Roll-Bonded Stainless Steel Laminate for Thick Housing Formability

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Solution Overview

Problem

Conventional roll-bonded laminates with a stainless steel and aluminum bi-layer structure face challenges in achieving high molding workability for housing applications due to increased thickness, which results in higher pressure requirements and reduced elongation, making it difficult to obtain suitable materials for electronic device housings.

Innovation Solution

A roll-bonded laminate with a stainless steel layer and a non-stainless steel metal layer, where the thickness of the stainless steel layer and its crystal plane orientation are optimized to satisfy a specific correlation, ensuring high molding workability, as determined by the Erichsen test, and suitable for electronic device housings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the thickness of the roll-bonded laminate is increased for housing applications, then the structural strength and suitability for housing are improved, but the pressure required for roll bonding increases and elongation decreases, making molding workability difficult

Engineering Contradiction:
Improvestructural strengthVSAvoidmolding workability
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The invention changes the crystallographic texture parameters of the stainless steel layer by controlling the half width FWHM200 of the (200) peak and the thickness proportion PSUS. This parameter optimization allows thick laminates (0.2-3.0 mm) to achieve both structural strength and high molding workability (Erichsen value of 7.0 mm or more) without requiring excessive roll bonding pressure

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a bi-layer composite structure consisting of a stainless steel layer and a non-stainless steel metal layer. This composite structure enables the laminate to achieve both the structural strength needed for housing applications and the elongation properties required for good molding workability, resolving the contradiction between thickness and formability

Inventive Principle:
Principle #40Composite materials

2Strength

If the thickness of the stainless steel layer is increased to meet housing requirements, then the structural integrity is improved, but the hardness increases and elongation decreases, reducing molding workability

Engineering Contradiction:
Improvestructural integrityVSAvoidmolding workability
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The invention optimizes the crystallographic texture parameters (FWHM200 and PSUS) of the stainless steel layer to control the relationship between thickness and hardness. By maintaining FWHM200 ≤ 0.0057PSUS + 0.4, the stainless steel layer achieves the required structural integrity while preserving sufficient elongation for molding workability, even at increased thickness

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If the roll-bonded laminate is optimized for thin applications with high elongation, then the Erichsen value is improved, but the thickness is insufficient for housing applications

Engineering Contradiction:
ImproveErichsen valueVSAvoidthickness
Core Design Contradiction:
Ease of operationVSLength of stationary object

Solution Approach 1:

The invention changes the crystallographic texture parameters (FWHM200 and PSUS relationship) to enable thick laminates (0.2-3.0 mm) to achieve high Erichsen values (7.0 mm or more). This parameter optimization allows the same elongation performance to be achieved in thick laminates suitable for housing applications, rather than being limited to thin laminates

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The optimized roll-bonded laminate achieves a stretch height of 7 mm or higher, providing excellent molding workability and suitable properties for electronic device housings, such as mobile devices, with improved radiation performance and lightweight properties.

Implementation Method 1

a roll-bonded laminate composed of a stainless steel layer and a non-stainless steel metal layer

Methodology Applied
Scientific EffectRoll bonding:

Implementation Method 2

a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) obtained by analyzing the stainless steel layer side via X-ray diffraction analysis

Methodology Applied
Scientific EffectX-ray diffraction: X-Ray

Data Source

PatentUS11840045B2Roll-bonded laminate
Publication Date: 2023.12.12 TOYO KOHAN CO LTD
  • US11840045B2 patent drawing
  • US11840045B2 patent drawing
  • US11840045B2 patent drawing

AI summary

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200≤0.0057PSUS+0.4.