Electronic Component Encapsulation With Gap-Controlled Roll Coating
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Solution Overview
Problem
Existing encapsulation methods for electronic components, such as photovoltaic cells, often result in damage due to the use of pre-formed films that are thick enough to be self-supporting, leading to potential damage from handling and the formation of voids or bubbles between the film and the components during the encapsulation process.
Innovation Solution
A method involving the application of a liquid encapsulating composition from an applicator roll, where the gap between the roll and the component controls the thickness of the encapsulating layer, ensuring minimal voids and avoiding the need for a pre-formed film or oven heating, using a system with an applicator roll, support structure, and elevator to manage the gap and application process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pre-formed film thick enough to be self-supporting is used, then the film can be handled before heating, but the film may damage electronic components due to its weight and the risk of shock or impact
Solution Approach 1:
The patent changes the physical state of the encapsulating material from a solid pre-formed film to a liquid or paste state during application. This allows the material to be applied in a thin, controlled layer that does not weigh enough to damage components, while still providing adequate encapsulation after curing or solidification.
Solution Approach 2:
The patent replaces the mechanical handling of thick pre-formed films with a liquid application system using applicators or dispensers. This substitution eliminates the need for mechanical support structures and heavy films, applying the encapsulating material directly in a controlled manner that prevents component damage.
2Ease of operation
If a pre-formed film thick enough to be self-supporting is used, then the film can be positioned on the component, but the resulting encapsulation layer becomes undesirably thick
Solution Approach 1:
The patent changes the encapsulating material from a thick solid film to a liquid or paste that can be applied in precisely controlled thin layers. This parameter change allows the encapsulation layer to be much thinner while still providing complete coverage and protection, eliminating the need for excessive thickness required for mechanical support.
Solution Approach 2:
The patent replaces the mechanical film positioning process with a liquid application system that uses applicators, dispensers, or coating mechanisms. This allows for precise control of layer thickness during application, ensuring the encapsulation layer is uniformly thin without requiring the material to be thick for structural support.
3Reliability
If a pre-formed film is used, then encapsulation can be achieved, but voids or bubbles form between the encapsulation layer and components due to trapped gas
Solution Approach 1:
The patent replaces the mechanical film placement process with a liquid application system. The liquid encapsulating material can flow around and conform to the component surfaces, completely wetting them and eliminating air pockets. This fluid application method inherently prevents void and bubble formation that occurs when trying to lay down thick pre-formed films.
Solution Approach 2:
The patent utilizes the fluid properties of liquid or paste encapsulating materials to eliminate trapped gas. The liquid material flows under the influence of gravity or applied pressure, completely filling all spaces and conforming to component contours, thereby displacing air and preventing void formation during the encapsulation process.
4Reliability
If a vacuum step is added to remove gas during encapsulation, then voids can be reduced, but additional processing steps are required
Solution Approach 1:
The patent replaces the vacuum removal process with a liquid application method that prevents void formation in the first place. By applying the encapsulating material in liquid form that flows and conforms to all surfaces, there is no trapped gas to remove, eliminating the need for vacuum equipment and additional processing steps.
Solution Approach 2:
The patent performs the gas elimination action preliminarily during the application stage rather than requiring a separate removal step. The liquid encapsulating material is applied in a manner that inherently excludes air and prevents void formation from the beginning, so no subsequent vacuum or degassing step is needed to achieve void-free encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively encapsulates components without damaging them and reduces the thickness of the encapsulation layer, minimizing voids and eliminating the need for additional processing steps like vacuum removal of gas, resulting in a more reliable and efficient encapsulation process.
Implementation Method 1
applying a first layer of an encapsulating composition onto a component from an applicator roll, the component being disposed on a substrate. The applicator roll includes an outer surface and is spaced apart from the component such that a gap exists between the applicator roll and the component. The gap controls the thickness of the first layer of encapsulating composition.
Implementation Method 2
The electronic components can be encapsulated on the substrate by placing a pre-formed film on top of the electronic components and then placing the substrate with the electronic components and the film into an oven. The oven can be used to heat the film, causing it to soften. The softened film can be shaped over the electronic component, and allowed to cool and solidify.
Data Source
AI summary
A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.