Low-Pressure Roll Texturing for Uniform Metal Strip Thickness

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Solution Overview

Problem

During the coil-to-coil process, applying a texture to a metal substrate can distort its characteristics due to the force applied by rolls, leading to thickness reduction and uneven pressure distribution.

Innovation Solution

A method involving a coil-to-coil processing system with vertically aligned upper and lower work rolls, supported by intermediate rolls, where bearings impart bearing loads to maintain contact pressure below the substrate's yield strength, allowing localized texture impression without thickness reduction, and sensors adjust pressure parameters for uniform texture distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high pressure is applied by rolls to imprint texture on metal substrate, then texture depth and definition are improved, but substrate thickness is reduced and substrate characteristics are distorted

Engineering Contradiction:
Improvetexture depthVSAvoidsubstrate thickness
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The patent changes the pressure parameter from high pressure to low pressure (below yield strength), and changes the repetition rate parameter to high frequency. This combination allows texture imprinting without excessive thickness reduction, as the low pressure prevents plastic deformation while the high frequency ensures adequate texture transfer

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies periodic action by increasing the repetition rate of the texturing process. The rolls apply texture impressions at high frequency, allowing the substrate to elastically recover between impressions. This periodic loading at low pressure accumulates texture depth over multiple cycles without causing permanent thickness reduction

Inventive Principle:
Principle #19Periodic action

2Manufacturing precision

If high pressure is applied by rolls to imprint texture on metal substrate, then texture definition is improved, but substrate characteristics are distorted

Engineering Contradiction:
Improvetexture definitionVSAvoidsubstrate characteristics
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent changes the pressure parameter to remain below the substrate's yield strength, preventing plastic deformation and characteristic distortion. Simultaneously, the repetition rate is increased to compensate for the lower pressure, ensuring adequate texture definition through cumulative elastic deformation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

By applying periodic low-pressure impressions at high repetition rates, the substrate undergoes repeated elastic deformation that accumulates to create well-defined textures. The short intervals between impressions allow elastic recovery while building up the desired texture pattern without permanent substrate distortion

Inventive Principle:
Principle #19Periodic action

3Volume of moving object

If pressure is reduced to maintain constant thickness, then thickness stability is improved, but texture transfer quality deteriorates

Engineering Contradiction:
Improvesubstrate thicknessVSAvoidtexture transfer quality
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent compensates for reduced pressure by increasing the repetition rate of texture application. Multiple low-pressure impressions are applied in rapid succession, allowing elastic deformation to accumulate and achieve adequate texture transfer quality while maintaining constant substrate thickness

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent changes the process parameters from low repetition rate/high pressure to high repetition rate/low pressure. This parameter transformation maintains texture transfer quality by using frequent low-pressure impulses that accumulate elastic deformation, equivalent to or better than fewer high-pressure impressions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method ensures the metal substrate's thickness remains constant while applying textures with enhanced characteristics like improved lubricant retention, resistance to spot weldability, and reduced galling, facilitating easier processing into automotive parts and other products with consistent frictional properties.

Implementation Method 1

The bearings are configured to impart bearing loads on the intermediate rolls such that the work rolls impart a work roll pressure on the metal substrate that is below a yield strength of the metal substrate

Methodology Applied
Scientific EffectPressure below yield strength: Pressure Increase

Data Source

PatentUS11426777B2Systems and methods for controlling surface texturing of a metal substrate with low pressure rolling
Publication Date: 2022.08.30 NOVELIS INC(US)
  • US11426777B2 patent drawing
  • US11426777B2 patent drawing
  • US11426777B2 patent drawing

AI summary

Systems and methods of applying a texture on a substrate include applying a texture to the substrate with a work stand of a coil-to-coil process. The work stand includes an upper work roll and a lower work roll vertically aligned with the upper work roll. At least one of the upper work roll and the lower work roll includes the texture. Applying the texture includes applying, by the upper work roll and a lower work roll, a work roll pressure on an upper surface and a lower surface of the substrate. The method further includes adjusting a contact pressure parameter of the work stand such that the work stand provides a desired contact pressure distribution across the width of the substrate and a desired thickness profile of the edges of the substrate while an overall thickness of the substrate remains substantially constant.