Roll-to-Attach Mechanism for Batch Micro LED Transfer
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Solution Overview
Problem
Conventional manufacturing processes for micro LEDs face challenges in efficiently picking and transferring large amounts of micro semiconductor structures due to limitations in scale minimization and low yield, particularly with the micronization of LED dies, which hinders the demand for high-volume production.
Innovation Solution
A method of batch transferring micro semiconductor structures involves attaching an adhesive material to a semiconductor device with array-type micro structures, removing the native substrate, and using a roll-to-attach mechanism to alternately process linear contacts for picking up and transferring the structures in batch to a target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional pick-up head is used to transfer LED dies one by one, then the transfer process can be performed, but the productivity is very low and the yield is reduced due to the huge amount of micro LED dies
Solution Approach 1:
The patent merges multiple individual transfer operations into a single batch transfer operation. The pick-up head is designed to simultaneously pick up multiple micro LED dies from the first substrate and transfer them to the second substrate in one operation, thereby dramatically increasing productivity while handling large quantities of dies.
Solution Approach 2:
The patent segments the transfer process into distinct phases: picking phase where multiple dies are simultaneously captured, transporting phase where they are moved together, and releasing phase where they are deposited on the target substrate. This segmentation enables efficient batch processing of large numbers of micro LED dies.
2Manufacturing precision
If the die size is micronized to meet market demand, then the resolution and performance improve, but the conventional pick-up head cannot effectively pick up the micro LED dies due to limitation in scale minimization
Solution Approach 1:
The pick-up head is designed with locally optimized pickup elements that are specifically tailored to the micronized die dimensions. The pickup structure includes features such as adjusted pickup element spacing, size, and geometry that match the reduced die size, enabling effective grasping and transfer of micro LED dies at the micron scale.
3Reliability
If conventional one-by-one transfer process is used, then each die can be individually placed, but the assembly cost increases and production yield decreases due to the huge amount of workpieces
Solution Approach 1:
The patent combines multiple individual placement operations into a single batch placement operation. By simultaneously transferring and placing multiple micro LED dies in one operation, the system maintains placement accuracy for each die while dramatically reducing the total number of operations required, thereby lowering assembly costs and increasing production yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively and efficiently transfers a large number of micro semiconductor structures without damage, increasing production yield and reducing assembly costs, thereby addressing the limitations of conventional processes.
Implementation Method 1
attaching an adhesive material to a semiconductor device
Data Source
AI summary
A method of batch transferring micro semiconductor structures is provided for effectively and efficiently picking up a batch of or a large amount of micro structures and transferring them to a target substrate, so it can be widely applied in transferring a lot of various micro semiconductor structures. The method includes steps of: attaching an adhesive material to a plurality of array-type micro semiconductor structures; and providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate. The array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.