Roll-to-roll transfer of thin conductive elements on elastic webs
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Solution Overview
Problem
Existing roll-to-roll processing methods struggle to accurately and reliably transfer thin conductive elements onto elastic and/or stretchable carrier webs without compromising their mechanical properties or requiring additional reinforcing layers.
Innovation Solution
The method involves using two different types of adhesives in selected stages of the roll-to-roll processing: a releasably binding adhesive to support the conductive layer during patterning and a carrier binding adhesive for secure attachment to the carrier web, allowing for accurate transfer and maintenance of web-like mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods with reinforcing underlay are used, then the conductive element can be transferred robustly, but the elastic properties and deformability of the receiving carrier are compromised
Solution Approach 1:
The conductive element is segmented into isolated patterned regions on the carrier web, allowing each segment to conform to the underlying carrier deformations independently, thus maintaining carrier elasticity while providing robust conductive paths where needed
Solution Approach 2:
The conductive element is formed as a thin flexible patterned layer directly on the carrier web without rigid reinforcing underlay, enabling the carrier to deform elastically while maintaining the integrity of the conductive pattern through careful design of pattern geometry and adhesive selection
2Reliability
If additional reinforcing layers are added for element transfer, then the transfer process becomes more reliable, but the thickness and web-like form factor are compromised
Solution Approach 1:
The reinforcing underlay function is extracted and eliminated entirely. Instead, the conductive element is formed directly as a thin patterned layer on the carrier web using printing or deposition techniques, achieving reliable transfer without adding the thickness associated with traditional reinforcing layers
Solution Approach 2:
The conductive element is implemented as an ultra-thin flexible film or printed pattern directly on the carrier web, maintaining the web-like form factor and minimal thickness while providing sufficient mechanical integrity for the application
3Manufacturing precision
If intermediate carrier layers are used for conductive element transfer, then the element can be transferred accurately, but the structural integrity and bond continuity of the composite body are compromised
Solution Approach 1:
The intermediate carrier layer is extracted and eliminated. The conductive element is formed directly on the final carrier web in the desired pattern, ensuring continuous structural bonds throughout the composite body while maintaining precise element positioning through controlled deposition or printing processes
Solution Approach 2:
The conductive element formation process is merged with the carrier web fabrication process itself, forming the conductive pattern directly on the carrier web in a single integrated step, thereby eliminating intermediate layers and ensuring continuous structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the accurate and reliable transfer of very thin conductive elements onto elastic carrier webs, preserving the web's mechanical properties and avoiding the need for additional reinforcing layers.
Implementation Method 1
a first adhesive is provided between a surface of the conducting layer and a surface of the first substrate layer so that when the surfaces are put into contact, adhesion of the first adhesive can be activated to bind the surfaces to each other
Implementation Method 2
a second adhesive is provided between a surface of the second substrate layer and top surfaces of the conductive elements so that when the surfaces are put into contact, adhesion of the second adhesive can be activated to bind the surfaces to each other
Data Source
Figure 1~3
Figure 4~6b
Figure 7~9b
AI summary
An object with a conductive element on a receiving carrier layer and a roll-to-roll processing method for manufacturing it. The solution is based on the idea of operating systematically with two different types of adhesives in selected stages of the roll-to-roll processing. A very thin layer of conductive material can be accurately and reliably transferred to adhesively attach on a desired carrier surface.