Roll-to-Roll Plasma CVD for Stable Gas Barrier Film Production
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Solution Overview
Problem
Existing methods for manufacturing gas barrier films using roll-to-roll plasma CVD face issues with abnormal discharge during film formation, leading to damage of the inorganic layer and support, which affects the gas barrier performance and stability of the film production process.
Innovation Solution
A method involving a preliminary film forming step with reduced power and slower speed is employed to create a low-density insulating inorganic layer on the conductor electrode, followed by a gradual power increase and speed transition to the main film forming step, ensuring stable plasma formation and suppression of abnormal discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power is applied during film formation to improve productivity, then film formation speed increases, but abnormal discharge occurs causing damage to the inorganic layer and support
Solution Approach 1:
The patent applies preliminary action by forming an insulating inorganic layer on the conductor electrode surface before the main film formation process. This preliminary layer prevents abnormal discharge during high-power operation, enabling stable and productive film formation without damage to the inorganic layer or support.
2Productivity
If fast transport speed is used to improve productivity, then production efficiency increases, but abnormal discharge occurs leading to film defects
Solution Approach 1:
The insulating inorganic layer formed in advance on the conductor electrode prevents abnormal discharge even at high transport speeds. This allows the system to maintain both high productivity and consistent film quality without defects caused by electrical instability.
3Productivity
If continuous film formation is performed to improve productivity, then output increases, but film deposits on the electrode accumulating over time causing process instability
Solution Approach 1:
The insulating inorganic layer formed on the conductor electrode acts as an intermediary barrier that prevents direct contact between the plasma and the electrode surface. This intermediary layer reduces film deposition on the electrode during continuous operation, maintaining process stability while enabling high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the stable production of high-performance gas barrier films by preventing abnormal discharge, maintaining the integrity of the inorganic layer and support, thereby ensuring consistent film quality.
Implementation Method 1
forming an inorganic layer on an elongated support or on an underlying organic layer on the support while transporting the support in a longitudinal direction, wherein a plasma is generated by supplying raw material gas between the support and a conductor electrode having a porous structure that is disposed to face the support, and the inorganic layer is formed using a plasma chemical vapor deposition method
Data Source
AI summary
Provided is a method of manufacturing a gas barrier film in which, in a case where a film is continuously formed on an elongated support through RtoR, abnormal discharge can be suppressed, and a gas barrier film having high gas barrier performance can be stably prepared. There is provided a method of manufacturing a gas barrier film, the method including: forming an inorganic layer on an elongated support or on an underlying organic layer on the support while transporting the support in a longitudinal direction, in which a plasma is generated by supplying raw material gas between the support and a conductor electrode having a porous structure that is disposed to face the support, and the inorganic layer is formed using a plasma chemical vapor deposition method, and before a main film forming step of forming the inorganic layer on the support or on the underlying organic layer on the support, a preliminary film forming step is provided, the preliminary film forming step being a step of forming an insulating inorganic layer having a lower density than the inorganic layer on a surface of the conductor electrode by setting power that is applied to the conductor electrode to be lower than power in the main film forming step while continuing the supply of the raw material gas and the application of the power until the main film forming step.