Rollable Semiconductor Substrate for Compact Intravascular Ultrasound Scanner
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Solution Overview
Problem
Current solid-state IVUS devices face challenges in reducing their overall diameter and length of rigid portions, limiting access to complex vascular structures due to geometric constraints and manufacturing complexities, which affects their agility and maneuverability within the vasculature.
Innovation Solution
The development of a compact IVUS device with a rollable semiconductor substrate that integrates transducers and control logic, allowing for a more cylindrical form and reducing the size by eliminating gaps between discrete components, thereby decreasing the scanner assembly's diameter and length, and improving manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete transducer elements and control logic are separately assembled, then device functionality is achieved, but device diameter and length increase due to gaps between components
Solution Approach 1:
The patent integrates transducer elements and control logic onto a single semiconductor substrate, eliminating the need for separate assembly of discrete components. This merging approach reduces the scanner assembly size by removing gaps between components while maintaining all necessary functionalities.
Solution Approach 2:
The control logic is embedded within the semiconductor substrate that also hosts the transducer elements, creating a nested structure where one component is integrated into another. This nesting eliminates external connections and reduces overall device volume.
2Stability of the object's composition
If rigid segments are used in solid-state IVUS devices, then structural stability is improved, but ability to advance around sharp bends is reduced
Solution Approach 1:
The patent employs a flexible semiconductor substrate that can bend and conform to the vascular geometry. This flexible substrate maintains structural integrity through its material properties while enabling the device to navigate sharp bends in blood vessels, resolving the contradiction between stability and adaptability.
3Productivity
If transducer array and electronics are integrated on semiconductor substrate, then manufacturing efficiency is improved, but fabrication precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical assembly processes with semiconductor fabrication techniques. Standard semiconductor manufacturing methods are used to pattern and integrate transducer elements and control logic on the substrate, achieving high precision through established fabrication processes rather than manual assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more agile and flexible IVUS device capable of navigating complex vascular branches with improved patient safety and comfort, while simplifying the manufacturing process and enhancing device reliability.
Implementation Method 1
an array of ultrasound transducers, such as piezoelectric zirconate transducers (PZTs)
Implementation Method 2
Ultrasonic waves are partially reflected by discontinuities arising from tissue structures
Data Source
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AI summary
Solid-state ultrasound imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient ultrasound transducer scanner formed from a substantially cylindrical semiconductor substrate. In some embodiments, an intravascular ultrasound (IVUS) device includes: an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including a semiconductor substrate having a plurality of transistors formed thereupon. The semiconductor substrate is curved to have a substantially cylindrical form when the ultrasound scanner assembly is in a rolled form, and the plurality of transistors are arranged in a cylindrical arrangement when the ultrasound scanner assembly is in the rolled form. In one such embodiment, the device further includes a plurality of ultrasound transducers formed upon the semiconductor substrate and arranged in a cylindrical arrangement when the ultrasound scanner assembly is in the rolled form.