Rollable Thermal Diffusion Member for Sliding Display Heat Dissipation
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Solution Overview
Problem
Electronic devices with sliding or rollable displays face heat dissipation issues due to heat generation from components like AP, CP, PMIC, and power amplifiers, leading to operational failures and reduced service life.
Innovation Solution
Incorporation of a thermal diffusion member that diffuses and dissipates heat generated by these components to a designated space within or outside the device using a thermal diffusion member wound around a shaft, which expands during the sliding-out operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal diffusion member is added to dissipate heat, then heat dissipation performance is improved, but device structure becomes more complex
Solution Approach 1:
The thermal diffusion member is integrated with the flexible display assembly, combining the heat dissipation function with the existing display structure. The thermal diffusion member is disposed between the flexible display and the housing, merging thermal management with the display subsystem rather than adding a completely separate cooling system.
Solution Approach 2:
The thermal diffusion member serves multiple functions: it diffuses heat from electronic components, maintains thermal equilibrium across the device, and is integrated with the flexible display mechanism. This multi-functional approach reduces the need for additional dedicated heat dissipation components.
2Temperature
If the thermal diffusion member is integrated with the flexible display, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The thermal diffusion member is pre-assembled with the flexible display before the entire assembly is integrated into the housing. This preliminary assembly allows for optimized thermal pathways to be established during manufacturing, and the pre-integrated unit can be installed as a single component, simplifying the overall manufacturing process.
3Reliability
If heat is dissipated to the outside, then component lifespan is extended, but thermal management complexity increases
Solution Approach 1:
The thermal diffusion member extracts heat from the electronic components and conducts it away from the heat-generating areas toward the housing and flexible display assembly, which serve as heat sink structures. This extraction and redistribution of thermal energy reduces peak temperatures at critical components without requiring complex active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively lowers the surface temperature of the device, improving the performance and lifespan of electronic components by efficiently dissipating heat.
Implementation Method 1
a thermal diffusion member including a first end disposed on the at least one electronic component and a second end coupled to the first shaft, the thermal diffusion member being configured to be partially wound around and unwound from the first shaft
Data Source
AI summary
An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.