Rolled Neural Electrode Arrays for Deep-Brain Signal Detection
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Solution Overview
Problem
Existing neural electrodes face challenges in reaching deep brain regions due to rigidity, mechanical incompatibility with neural tissues, and limitations in longitudinal dimensions, and traditional soldering techniques complicate connections between electronic components.
Innovation Solution
A flexible neural electrode array is formed by rolling a planar electrode array around a carrier, with adjustable length and high mechanical stability, and a method for reversible connection of electronic components using a solution environment to form a physically electrically conductive connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If CMOS-based silicon neural electrodes are used, then high throughput for neuronal signal detection is achieved, but mechanical compatibility with neural tissues deteriorates and the electrodes are easy to break
Solution Approach 1:
The patent applies flexible polymer film fabrication technology to replace rigid CMOS-based silicon electrodes. The flexible neural electrode array is formed by rolling a planar electrode array around a carrier, creating a flexible structure that can be implanted in deep brain regions without breaking or causing mechanical damage to neural tissues.
Solution Approach 2:
The patent uses composite material structures combining flexible polymer films with conductive materials to create neural electrodes that are both mechanically compatible with neural tissues and electrically functional for high-throughput signal detection.
2Reliability
If flexible neural electrodes generated based on polymer film fabrication technology are used, then biocompatibility and long-term stability are improved, but the preparation and performance are restricted by the complexity of micro/nano fabrication
Solution Approach 1:
The patent segments the neural electrode into distinct functional parts: electrode sites for neural signal detection, lead parts for electrical connection, and interface parts for external device connection. This segmentation allows each part to be optimized independently and simplifies the fabrication process compared to monolithic designs.
Solution Approach 2:
The patent transitions from planar two-dimensional electrode arrays to three-dimensional flexible structures by rolling around a carrier. This dimensional change enables the electrodes to reach deep brain regions while maintaining fabrication simplicity through planar processing techniques.
3Reliability
If traditional soldering techniques are used to connect electronic components, then electrical connections are formed, but strict requirements on external conditions (temperature, pressure) are imposed and separation is difficult
Solution Approach 1:
The patent replaces traditional thermal-mechanical soldering with a mechanical connection system using connection parts and connection structures. This allows electrical connections to be formed through simple mechanical assembly without requiring strict temperature or pressure conditions, enabling easy separation and reconnection.
Data Source
AI summary
The present disclosure relates to an electronic device and a method thereof. The device may include a target electrode array having a plurality of electrode sites arranged circumferentially around a surface of the device and/or axially along the surface of the device. The device may be formed by scrolling and/or attaching a planar electrode array around a carrier.