Cooling Roller Charging Layout to Prevent Vapor Deposition Discharge
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Solution Overview
Problem
Existing vapor deposition film manufacturing apparatuses face issues with unintended discharge due to electron emission in higher atmospheric pressure areas, leading to abnormal discharge and increased apparatus size and cost when additional vacuum pumps are required to maintain low pressure.
Innovation Solution
A vapor deposition film manufacturing apparatus is partitioned into upper and lower chambers with a cooling roller, using a hollow cathode electron supply chamber to ionize and accelerate electrons for adhesion, and a prevention body to suppress unintended discharge, maintaining appropriate vacuum levels without increasing apparatus size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a third vacuum pump system is introduced to maintain low pressure near the wire to prevent abnormal discharge, then abnormal discharge is avoided, but the apparatus size increases
Solution Approach 1:
The chamber is divided into an upper chamber and a lower chamber with different pressure zones. The electron supply chamber is located in the upper chamber where electrons are generated, while the lower chamber maintains higher vacuum for vapor deposition. This segmentation allows electron generation at atmospheric pressure without requiring the entire apparatus to be under high vacuum, thus preventing abnormal discharge without increasing apparatus size.
Solution Approach 2:
A magnetic field is introduced as an intermediary to control and confine electrons generated in the upper chamber. The magnetic field directs electrons toward the lower chamber where vapor deposition occurs, preventing electron diffusion into the upper chamber atmosphere that would cause abnormal discharge. This allows the system to maintain different pressure conditions in different chambers without requiring additional vacuum pumps.
2Reliability
If the entire upper chamber is maintained at low pressure to prevent abnormal discharge, then discharge is suppressed, but the apparatus configuration increases in size
Solution Approach 1:
The chamber is divided into an upper chamber and a lower chamber with different pressure zones. The electron supply chamber is located in the upper chamber where electrons are generated, while the lower chamber maintains higher vacuum for vapor deposition. This segmentation allows electron generation at atmospheric pressure without requiring the entire apparatus to be under high vacuum, thus preventing abnormal discharge without increasing apparatus size.
3Reliability
If a partition is introduced to create separate vacuum zones, then abnormal discharge is prevented, but the apparatus size increases
Solution Approach 1:
The chamber is divided into an upper chamber and a lower chamber with different pressure zones. The electron supply chamber is located in the upper chamber where electrons are generated, while the lower chamber maintains higher vacuum for vapor deposition. This segmentation allows electron generation at atmospheric pressure without requiring the entire apparatus to be under high vacuum, thus preventing abnormal discharge without increasing apparatus size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high-quality metal vapor deposition films with enhanced adhesion and reliability while preventing unintended discharge, achieving efficient operation without enlarging the apparatus.
Implementation Method 1
a power supply unit configured to ionize gas inside the electron supply chamber via the hollow cathode
Implementation Method 2
The mechanism energizes a tungsten wire arranged so as to extend above the can-roller longitudinally in an axial direction of the can-roller, and the energization of the tungsten wire causes generation of thermoelectrons, thereby charging the can-roller
Implementation Method 3
an evaporation unit, which is arranged in the lower chamber, and is configured to diffuse metal vapor toward the dielectric film
Data Source
AI summary
Provided is a vapor deposition film manufacturing apparatus 1 which is partitioned into an upper chamber 10U and a lower chamber 10D with a can-roller (cooling roller) 201 provided therebetween, including: a lower-chamber vacuum unit 500; an upper-chamber vacuum unit 400; an electron supply chamber 601 which houses therein a hollow cathode 611; a valve 621 configured to supply gas for ionization while maintaining an inside of the electron supply chamber 601 at a predetermined vacuum degree; and a power supply 603 configured to ionize gas inside the electron supply chamber 601. A slit 613 is provided in the electron supply chamber 601 so as to be opened toward a surface of the roller 201. A diffusion preventing cover 604 is provided to prevent rebound electrons from diffusing from the roller 201 side. Adhesiveness of the film is enhanced by properly charging the surface of the roller 201.