Roof Computer Cooling Layout With Drain Gap and Fan Deflector
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing roof antenna modules for vehicles face issues with high temperatures, water infiltration risk, and inefficiencies in heat dissipation due to the use of seals, which reduce airflow and increase noise, weight, and assembly complexity.
Innovation Solution
A heat dissipation device with a radial fan housed within the casing, featuring a truncated ramp and a deflector to allow liquid drainage and minimize air recirculation, eliminating the need for seals and enabling a larger, slower-rotating fan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat dissipation device is disposed between the processor and the heat dissipation fin array, then the processor is protected from direct exposure to water and the heat dissipation fin array is protected from corrosion, but the heat dissipation efficiency is reduced due to additional thermal resistance
Solution Approach 1:
The patent implements a nested structure where the processor is embedded within the water block, which in turn is surrounded by the heat dissipation fin array. The water block acts as an intermediary layer that嵌套 (nests) between the processor and the fin array, providing corrosion protection while maintaining thermal contact through direct physical coupling.
Solution Approach 2:
The water block serves as a thermal intermediary component that mediates heat transfer between the processor and the heat dissipation fin array. It provides a corrosion-resistant interface while maintaining efficient thermal conduction, thus protecting both the processor and fin array from direct water exposure.
2Temperature
If the processor is in direct contact with the heat dissipation fin array, then heat dissipation efficiency is maximized, but the processor and heat dissipation fin array are exposed to water causing corrosion
Solution Approach 1:
The patent implements a nested structure where the processor is embedded within the water block, which in turn is surrounded by the heat dissipation fin array. The water block acts as an intermediary layer that嵌套 (nests) between the processor and the fin array, providing corrosion protection while maintaining thermal contact through direct physical coupling.
Solution Approach 2:
The water block serves as a thermal intermediary component that mediates heat transfer between the processor and the heat dissipation fin array. It provides a corrosion-resistant interface while maintaining efficient thermal conduction, thus protecting both the processor and fin array from direct water exposure.
3Temperature
If thermal paste is applied between the processor and water block, then thermal contact is improved, but the complexity of assembly and maintenance increases
Solution Approach 1:
The patent employs thermal paste that automatically fills and adapts to the microscopic gaps and surface irregularities between the processor and water block during assembly. This self-adjusting property eliminates the need for precise manual application techniques, allowing the thermal interface material to self-optimize the thermal contact without requiring complex assembly procedures or specialized skills.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling performance, reduces noise and energy consumption, simplifies assembly, and decreases weight by allowing a thicker fan and smaller cover design.
Implementation Method 1
a water block configured to be in contact with the processor and the heat dissipation fin array
Implementation Method 2
a heat dissipation fin array extending from the water block in a direction opposite to the processor
Implementation Method 3
a heat dissipation fin array extending from the water block in a direction opposite to the processor
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to a heat dissipation device for an electronic computer housed in the roof of a vehicle, comprising a radial fan (204) housed in the thickness of a casing of said computer and configured to circulate a flow of air from a bottom face of the casing to the top of the casing via a ramp (207) positioned facing the exhaust (206) of the fan. The device is characterised in that the lower part of the ramp (207) is truncated to form a gap (208) between said ramp and the fan and to allow a liquid to flow from a top part to the bottom of the casing, and a deflector (209) is positioned at the outlet of the fan to direct the flow of air towards said ramp.