Roof Shingle Patch Repair for Sealing Voids Under Overlaps
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Solution Overview
Problem
Existing methods for repairing damaged roof shingles are time-consuming, costly, and unreliable, as they either require replacing the shingle, which disrupts the adhesive bond with overlapping shingles, or using sealants that may not form a reliable seal due to setting time issues and lack of visibility during application.
Innovation Solution
A patch is inserted between compromised and overlapping shingles to seal voids while reforming the adhesive bond, using a substrate with adhesive on both surfaces to secure the patch and re-establish the bond, ensuring a robust seal and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shingle is replaced to repair a void, then the void is sealed, but the adhesive bond with overlapping shingles is disrupted and requires breaking
Solution Approach 1:
The repair system segments the repair function into distinct components: a patch substrate for structural coverage, adhesive for bond restoration, and sealant for void sealing. This segmentation allows each component to perform its specific function without disrupting the overall adhesive bond between shingles.
Solution Approach 2:
The patch and adhesive assembly is prepared in advance as a pre-formed unit with adhesive already applied to the patch substrate. This preliminary preparation eliminates the need to disrupt existing adhesive bonds during repair, as the patch can be directly inserted and bonded to seal the void while maintaining the integrity of surrounding adhesive bonds.
2Reliability
If sealant is applied to repair a void, then the void is sealed, but the setting time is extended and visibility during application is reduced
Solution Approach 1:
The sealant is formulated with modified rheological parameters, specifically a thixotropic consistency that allows it to remain workable and visible during application, then rapidly set upon insertion. The sealant's properties are changed to provide extended open time for positioning while maintaining visibility, then quickly harden to seal the void effectively.
3Strength
If a patch with adhesive on both surfaces is used, then the adhesive bond is reformed and structural integrity is restored, but the device complexity increases
Solution Approach 1:
The patch substrate, adhesive layers, and sealant are merged into a single integrated repair unit. The adhesive is applied to both surfaces of the patch substrate during manufacturing, creating a sandwich structure that combines bonding functionality with void-sealing capability in one component, eliminating the need for separate adhesive application steps.
Solution Approach 2:
The patch is designed as a self-contained repair solution where the adhesive is pre-applied and the sealant is pre-positioned. When installed, the patch automatically forms adhesive bonds with both the compromised shingle and the overlapping shingle, and the sealant automatically fills the void, requiring no additional materials or complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The patch effectively seals voids in shingles, restoring the adhesive bond and preventing wind damage, while being quicker and more reliable than traditional methods.
Implementation Method 1
a patch adhesive that is disposed on at least a portion of a top surface and at least a portion of a bottom surface of the substrate... urging at least a portion of the patch adhesive that is disposed on the bottom surface of the substrate into the void to seal the void
Data Source
AI summary
A method for repairing a roof includes identifying a compromised shingle having a void. The method includes disconnecting at least a portion of the compromised shingle from an overlapping shingle that overlaps at least a portion of the compromised shingle by breaking a length of a bond that connects the compromised shingle to the overlapping shingle that is proximate the void. The method includes inserting at least a portion of a patch between the compromised shingle and the overlapping shingle to cover the void, in which the patch includes a generally planar substrate and a patch adhesive. The method includes applying a generally downward force to a portion of at least one of the patch or the overlapping shingle to urge at least a portion of the patch adhesive into the void to seal the void.