Room Temperature Bonding Apparatus with Angle Adjustment
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Solution Overview
Problem
Current room temperature bonding apparatuses face challenges in reliably bonding substrates at room temperature with uniform load distribution, longevity, compactness, cost-effectiveness, and high production efficiency, particularly in mass production scenarios.
Innovation Solution
The apparatus incorporates an angle adjustment mechanism, mechanical lock mechanisms, and a surface cleaning system to ensure precise alignment and uniform load application on substrates, along with a vacuum environment and efficient transfer devices to enhance bonding reliability and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a room temperature bonding apparatus is designed for mass production with long lifetime and compact size, then productivity and reliability are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The bonding apparatus is divided into separate functional modules: a bonding chamber for substrate bonding, a cleaning chamber for surface preparation, and a transfer mechanism. This segmentation allows each module to be optimized independently for its specific function, improving overall productivity without excessively increasing the complexity of the entire system.
Solution Approach 2:
The transfer mechanism serves multiple functions: it transports substrates between chambers, positions substrates for bonding, and facilitates chamber evacuation. This multi-functionality reduces the need for separate dedicated mechanisms, thereby improving productivity while controlling device complexity.
2Strength
If bonding surfaces are sputter-etched prior to bonding in vacuum at room temperature, then bonding strength is improved, but processing time and energy consumption increase
Solution Approach 1:
The bonding surfaces are sputter-etched in advance within the bonding chamber before the actual bonding process. This preliminary surface preparation ensures high bonding strength is achieved during the subsequent bonding step, optimizing the strength-time tradeoff by preparing surfaces beforehand rather than during bonding.
Solution Approach 2:
The sputter-etching process is performed in a vacuum environment using inert gas ions, which removes contaminants from bonding surfaces without requiring additional chemical cleaning steps. This achieves high bonding strength while minimizing processing time and avoiding the need for separate cleaning chambers.
3Reliability
If a mechanical lock mechanism is used to fix the cartridge, then reliability is improved, but device complexity and ease of operation worsen
Solution Approach 1:
The mechanical lock mechanism is designed to automatically engage and disengage the cartridge based on chamber pressure differential. When the chamber evacuates, the pressure difference automatically locks the cartridge in place; when vented, it automatically releases. This self-service mechanism improves reliability without requiring manual intervention, thus maintaining ease of operation.
4Reliability
If the elastic guide supports the carriage to prevent contact, then reliability is improved, but device complexity increases
Solution Approach 1:
An elastic guide is installed between the carriage and the chamber wall to provide cushioning support. This elastic element prevents direct contact and potential damage between the carriage and wall while allowing necessary movement. The beforehand cushioning improves reliability by preventing mechanical failures without requiring complex active control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more reliable and efficient room temperature bonding with improved load distribution, extended apparatus lifetime, reduced contamination, and increased production capacity per unit time, making it suitable for mass production.
Implementation Method 1
bonding surfaces of the both silicon wafers are sputter-etched prior to bonding by irradiating the bonding surfaces of the silicon wafers with an inert gas ion beam
Implementation Method 2
a bonding chamber that generates a vacuum ambient for room temperature bonding between an upper substrate and a lower substrate
Data Source
AI summary
A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.