Rotary Arm Sensor for In-Situ Substrate Measurement
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Solution Overview
Problem
Existing substrate processing apparatuses lack efficient measurement capabilities within the processing container, particularly for wafers being processed simultaneously in multiple spaces, as they do not consider measurements for the substrate stage or wafers placed inside the container.
Innovation Solution
A substrate processing apparatus with a rotary arm having end effectors capable of holding wafers and a sensor on its back surface, positioned equidistant from multiple processing spaces, allowing for rotation to face the substrate stage or wafer for measurement without hindering vertical movement, enabling in-situ measurement of parameters like film thickness and surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a sensor is installed inside the processing container to measure substrates during processing, then measurement precision is improved, but the sensor may hinder the vertical movement of the substrate stage or wafers
Solution Approach 1:
The sensor is mounted on the rotary arm which rotates into position only when needed for measurement, rather than being statically positioned inside the processing container. This dynamic positioning allows the sensor to access the substrate for measurement while clearing the path for vertical substrate stage movement when the arm is rotated away from the measurement position.
Solution Approach 2:
The rotary arm serves as an intermediary mechanism that bridges the sensor and the substrate. Instead of placing the sensor directly in the path of vertical movement, the rotary arm rotates to bring the sensor into contact with the substrate for measurement, then rotates away to clear the path, thus mediating between the measurement need and the movement requirement.
2Measurement precision
If substrates are transferred outside the processing container for measurement, then measurement can be performed, but processing efficiency is reduced due to transfer time and loss of processing continuity
Solution Approach 1:
The sensor is pre-positioned on the rotary arm within the processing container, ready to measure substrates in-situ without requiring transfer outside. This preliminary arrangement of the measurement capability within the processing environment eliminates the need for substrate transfer, maintaining processing continuity and efficiency while enabling measurement.
Solution Approach 2:
The rotary arm with mounted sensor serves multiple functions: it can hold substrates during transfer between processing spaces and also perform in-situ measurement of substrates within the processing container. This multi-functionality eliminates the need for separate measurement equipment and substrate transfer, improving processing efficiency while maintaining measurement capability.
3Productivity
If multiple substrates are processed simultaneously in one processing container, then productivity is improved, but the ability to measure each substrate individually is reduced
Solution Approach 1:
The rotary arm can rotate to position the sensor over different processing spaces containing multiple substrates. This dynamic positioning allows individual measurement of each substrate while maintaining simultaneous processing in other spaces, resolving the contradiction between batch processing and individual measurement.
Solution Approach 2:
The processing container is divided into multiple processing spaces, and the rotary arm with sensor can selectively position over each space to measure individual substrates. This segmentation allows simultaneous processing in multiple spaces while enabling individual measurement when needed, without compromising either productivity or measurement precision.
Data Source
AI summary
A substrate processing apparatus includes: a processing container having a plurality of processing spaces formed therein; a substrate stage arranged in each of the plurality of processing spaces; a rotary arm including at least one end effector capable of holding a substrate and having a rotation axis located at a position equidistant from the plurality of processing spaces; a sensor provided on a back surface of the at least one end effector of the rotary arm, which is opposite to a substrate holding surface of the at least one end effector; and a rotation mechanism configured to rotate the rotary arm so that the sensor is moved to a position facing the substrate stage or the substrate placed on the substrate stage inside the processing container.