Rotary Bond Arm Actuator for Faster Semiconductor Die Bonding
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Solution Overview
Problem
Conventional die bonding devices are limited by the heavy bond head and linear motor design, which restricts the bond arm's driving force and acceleration, leading to slower pick-and-place operations.
Innovation Solution
A semiconductor die bonding device with a bond arm driven by an arc voice coil actuator, featuring arc-shaped magnets and a movable arc coil, allowing independent motion along the Z axis and enabling faster acceleration and speed by reducing inertia.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a linear motor is used to drive the bond arm along the Z axis, then the bond arm can be moved vertically, but the bond head becomes significantly heavier and acceleration is limited
Solution Approach 1:
The invention separates the vertical driving function from the bond head by using an independent linear motor mounted on the positioning table. The bond head only carries the bond arm structure without the heavy linear motor, thus reducing its weight while maintaining the driving capability through the separate motor on the table.
Solution Approach 2:
The invention introduces an intermediary mechanism where the linear motor is mounted on the positioning table rather than the bond head. This intermediary positioning allows the motor to drive the bond arm vertically without adding weight to the moving bond head assembly, resolving the weight-force tradeoff.
2Speed
If a heavy bond head is used to accommodate linear motors, then vertical motion is achieved, but acceleration and speed of the bond arm are reduced
Solution Approach 1:
The invention divides the system into two parts: the positioning table that carries the linear motor and the lightweight bond head that carries only the bond arm. This segmentation allows the bond head to be light for high acceleration while the separate motor on the table provides the necessary driving force.
Solution Approach 2:
The invention replaces the conventional mechanical system where the linear motor is integrated into the bond head with a new configuration where the motor is mounted on the positioning table. This substitution reduces the moving mass of the bond head while maintaining the mechanical driving function through the separate motor arrangement.
3Ease of operation
If the bond arm is driven by a linear motor mounted on the bond head, then vertical motion is achieved, but the design becomes more complex
Solution Approach 1:
The invention extracts the linear motor from the bond head and relocates it to the positioning table. This extraction simplifies the bond head design by removing the complex motor assembly, while the bond arm operation remains fully functional through the separate motor mounted on the table.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the bond arm's acceleration and speed, improving throughput and reducing the bonding impact force, while maintaining effective die placement and bonding operations.
Implementation Method 1
a voice coil actuator located at a second end of the bond arm body for driving the bond arm body to rotate about a pivot positioned between the collet and the voice coil actuator
Implementation Method 2
an arc coil including a concave arced surface disposed within the arc-shaped gap that is configured to be movable relative to the arc magnets
Data Source
AI summary
A semiconductor die bonding device has a bond arm body, a collet attached at a first end of the bond arm body for holding a semiconductor die during a pick-and-place operation, and a voice coil actuator located at a second end of the bond arm body for driving the bond arm body to rotate about a pivot positioned between the collet and the voice coil actuator. The voice coil actuator includes a pair of arc magnets having concave arced surfaces facing the pivot that form an arc-shaped gap between the arc magnets, and an arc coil including a concave arced surface disposed within the arc-shaped gap that is configured to be movable relative to the arc magnets.