Rotary Laser Machining Optics for High-NA Microstructuring Throughput
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Solution Overview
Problem
Microstructuring processes using ultrashort laser pulses with high numerical aperture machining optical units are limited in throughput and speed, and systems like polygon scanners are not suitable for large surface area machining or microstructuring with optical units having a large numerical aperture.
Innovation Solution
A device comprising a stationary input coupling system, a rotatable rotary system, and a machining optical unit that guides ultrashort laser pulses onto the material, with a beam influencing system for positioning and shaping the laser beam, enabling high-density machining over a large surface area by rotating the laser pulses across the material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ultrashort laser pulses with high numerical aperture machining optical units are used for microstructuring, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The patent employs a rotary system that rotates the machining optical unit and laser beam delivery system around a central axis, dynamically sweeping the high-precision laser focus across large surface areas. This dynamic rotation enables the high numerical aperture system to cover extensive areas while maintaining microstructuring precision, resolving the contradiction between precision and productivity
Solution Approach 2:
The invention introduces rotational movement as an additional dimension to the traditional linear laser machining approach. By rotating the optical unit around a central axis, the system transforms from a single-point static machining approach to a multi-point dynamic scanning approach, enabling large surface area machining while preserving the high precision capabilities of the high numerical aperture optical unit
2Productivity
If polygon scanners are used for large surface area machining, then productivity is improved, but manufacturing precision deteriorates for high numerical aperture systems
Solution Approach 1:
The patent introduces a rotary optical unit as an intermediary between the laser beam source and the workpiece. This rotary unit acts as a mediator that enables the high numerical aperture machining optical unit to access large surface areas through rotational movement, while maintaining the optical quality and precision required for microstructuring. The rotary system serves as the intermediary that reconciles the conflicting requirements of large area coverage and high precision
3Productivity
If the laser beam is rotated across the material surface, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent merges the rotation function into the existing optical unit assembly, combining the machining optical unit, beam influencing system, and rotation mechanism into an integrated rotary system. This merging approach enables the laser beam to be rotated across the material surface while minimizing additional complexity by consolidating multiple functions into a unified rotating assembly rather than adding separate independent systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves high machining density and efficiency by precisely positioning and shaping ultrashort laser pulses across the material's surface, overcoming the limitations of existing technologies in throughput and speed, particularly for microstructuring with high numerical aperture systems.
Implementation Method 1
an input coupling optical unit for input coupling the laser beam
Implementation Method 2
a rotary optical unit, and a machining optical unit... configured for guiding the laser beam into or onto the material
Implementation Method 3
a beam influencing system for positioning and/or shaping the laser beam in the corresponding machining plane
Implementation Method 4
microstructuring a material by means of ultrashort laser pulses from an ultrashort pulse laser
Implementation Method 5
ultrashort laser pulses from a laser beam of an ultrashort pulse laser
Data Source
AI summary
A device for machining a material using ultrashort laser pulses from a laser beam includes an input coupling system comprising an input coupling optical unit, a rotary system connected to the input coupling system and rotatable about an axis of rotation, and a machining optical unit connected to the rotary system and capable of being rotated together therewith and configured for guiding the laser beam into or onto the material to be machined. The input coupling optical unit is configured such that a laser beam is guided into a corresponding machining plane. A rotary optical unit of the rotary system and the machining optical unit are configured such that the corresponding machining plane is guided into a machining plane of the material to be machined. The device further includes a beam influencing system for positioning and/or shaping the laser beam in the corresponding machining plane.