Rotary Laser Trimming Control for Non-Overlapping Edge Processing
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Solution Overview
Problem
The manufacture of semiconductor devices, such as image sensors, faces challenges in accurate trimming processing due to the risk of cracks and chipping when using blade dicers, which complicates precise removal of unnecessary portions.
Innovation Solution
A laser processing apparatus with a rotatable support portion, a laser processing head, and a controller that controls the emission of laser light based on rotation information to form modified regions along the circumferential edges of the target, ensuring accurate and non-overlapping trimming by positioning the focusing point precisely and controlling the laser emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a blade dicer is used for trimming processing, then the unnecessary portions can be removed, but cracks or chipping occur in the target, making accurate trimming difficult
Solution Approach 1:
The patent replaces the mechanical blade dicing system with a laser-based processing system. The laser processing head irradiates the target with laser light to form modified regions along the circumferential edge, eliminating mechanical contact that causes chipping and cracks. This substitution of mechanical cutting with optical field processing resolves the contradiction between ease of trimming and trimming accuracy.
Solution Approach 2:
The patent changes the processing parameters by using laser light intensity and exposure control instead of mechanical blade force. The controller adjusts the laser emission based on rotation information to create precise modified regions without the physical contact that causes damage. This parameter change from mechanical force to optical energy enables accurate trimming without chipping.
2Productivity
If the laser light is emitted continuously while rotating the support portion, then the circumferential edge can be processed, but overlapping modified regions occur, reducing trimming accuracy
Solution Approach 1:
The patent implements periodic action by controlling the laser emission to start and stop based on rotation information. The laser is emitted only during specific angular positions of the rotation cycle, creating discrete modified regions that do not overlap. This periodic emission pattern maintains productivity while ensuring precise positioning of each modified region along the circumferential edge.
Solution Approach 2:
The system uses feedback from rotation information (rotation amount and position) to control laser emission timing. The controller receives real-time rotation data and adjusts laser emission accordingly, ensuring that each modified region is created at the correct position without overlapping previous regions. This closed-loop control maintains both productivity and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables accurate trimming processing by forming modified regions along the edges of semiconductor devices without overlapping, thereby preventing cracks and ensuring precise removal of unnecessary portions.
Implementation Method 1
a laser processing head configured to irradiate the target placed on the support portion with a laser light, to form a modified region in the target
Data Source
AI summary
A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.