Rotary Magnetron Cathode Layout for Low-Damage Sputter Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Sputter deposition methods can negatively affect sensitive substrates due to energetic particle bombardment, leading to reduced deposition quality and material utilization, and are unsuitable for mass production.
Innovation Solution
A sputter deposition source with an array of magnetron sputter cathodes featuring a rotary target and dual-sided closed plasma racetracks that redirect plasma confinement regions away from the substrate, enhancing material utilization and deposition quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional sputter deposition is used, then deposition rate is achieved, but substrate damage occurs due to energetic particle bombardment
Solution Approach 1:
The invention divides the plasma generation into multiple independent magnetron sputter cathodes arranged in an array, where each cathode generates plasma locally. This segmentation allows control over plasma direction and reduces harmful particle bombardment on the substrate while maintaining deposition rate through parallel operation of multiple cathodes.
Solution Approach 2:
The invention introduces a lateral dimension for plasma confinement by creating plasma racetracks that extend in the lateral direction parallel to the substrate surface rather than directly toward it. This dimensional change redirects the plasma path away from the substrate, reducing particle bombardment damage while still enabling material deposition.
2Productivity
If plasma confinement regions are directed toward the substrate, then deposition rate increases, but material utilization decreases
Solution Approach 1:
The plasma confinement regions are extended in the lateral dimension parallel to the substrate surface, creating a racetrack configuration. This redirects the plasma path away from direct bombardment of the substrate, reducing material waste through back-sputtering and improving material utilization while maintaining deposition rate through the array configuration.
3Object-affected harmful factors
If FTS systems with planar targets are used, then substrate damage is reduced, but plasma stability is limited
Solution Approach 1:
The invention uses multiple independent magnetron sputter cathodes in an array configuration, each capable of generating stable plasma independently. This segmentation provides redundancy and stability, as the failure or variation of one cathode does not affect the overall system performance, unlike single planar target FTS systems.
Solution Approach 2:
The invention combines multiple magnetron sputter cathodes into a unified array system that works together to deposit material on the substrate. This merging of multiple stable plasma sources provides both the reduced substrate damage of FTS and the plasma stability of magnetron sputtering.
4Object-affected harmful factors
If FTS systems are used, then substrate damage is reduced, but deposition rates and material utilization are reduced
Solution Approach 1:
The array of multiple magnetron sputter cathodes compensates for the lower deposition rate per cathode by operating in parallel, achieving high overall deposition rates while maintaining the reduced substrate damage benefits of FTS configuration.
Solution Approach 2:
The invention merges the advantages of magnetron sputtering (high deposition rate, good material utilization) with the FTS configuration (reduced substrate damage) by using magnetron cathodes in an FTS array arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces substrate damage and increases material utilization, enabling efficient and high-quality coating of sensitive substrates while maintaining high deposition rates.
Implementation Method 1
a magnet assembly arranged in the rotary target and configured to provide a closed plasma racetrack on a surface of the rotary target
Implementation Method 2
During sputtering, atoms are ejected from the surface of a sputter target by bombardment thereof with energetic particles of a plasma. The ejected atoms propagate toward the substrate and adhere thereon, so that a layer of sputtered material can be formed on the substrate.
Data Source
AI summary
A sputter deposition source for depositing a material on a substrate is described. The sputter deposition source includes an array of magnetron sputter cathodes arranged in a row for coating the substrate in a deposition area on a front side of the array. At least one magnetron sputter cathode of the array includes a first rotary target rotatable around a first rotation axis (A1); and a first magnet assembly arranged in the first rotary target and configured to provide a closed plasma racetrack (P) on a surface of the first rotary target that extends along the first rotation axis (A1) on a first side and on a second side of the at least one magnetron sputter cathode. Further described is a magnetron sputter cathode for a sputter deposition source and a method of depositing a material on a substrate.