Rotary Oscillator Array Clocking for Deterministic Multi-Die Phase Sync
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Solution Overview
Problem
Designing a robust, high-speed, low-skew, low-jitter, and low-power clock across chiplet-based systems is challenging due to the difficulties in enabling clock synchronization across multiple dies, which traditional asynchronous solutions fail to address effectively.
Innovation Solution
Implementing resonant rotary clocking using rotary traveling wave oscillators (RTWOs) and rotary oscillator arrays (ROAs) to distribute synchronized clock signals across a multi-die system, utilizing interconnects and inverter pairs to achieve deterministic phase points and frequency tuning, with features like programmable capacitors and power gating for efficient synchronization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional asynchronous solutions are used for clock distribution in multi-die systems, then design flexibility is maintained, but clock synchronization across multiple dies becomes extremely difficult
Solution Approach 1:
The patent introduces a base die as an intermediary component that receives a reference clock signal and generates synchronized clock signals for multiple chiplets. This base die acts as a mediator that translates the reference clock into distributed clock signals with controlled skew, enabling synchronization across multiple dies without requiring complex asynchronous protocols between each die pair.
Solution Approach 2:
The system segments the clock distribution function into two parts: a base die that handles reference clock reception and initial synchronization, and multiple chiplets that receive distributed clock signals. This segmentation allows the complex synchronization task to be divided into manageable functions, reducing overall design overhead while maintaining reliability.
2Area of stationary object
If clock signals are distributed across large areas in multi-die systems, then functionality is enhanced, but skew and jitter increase
Solution Approach 1:
The patent implements dynamic skew compensation by allowing the base die to adjust the phase and timing of clock signals distributed to different chiplets. This dynamic adjustment capability enables the system to maintain precise clock synchronization across large distribution areas, compensating for variations in signal propagation delay that occur over different physical distances.
3Speed
If high-speed clock signals are distributed across multiple dies, then operating characteristics are enhanced, but power consumption increases
Solution Approach 1:
The patent applies local quality by allowing each chiplet to receive clock signals optimized for its specific requirements while sharing the common reference clock infrastructure on the base die. This approach enables high-speed operation where needed while reducing overall power consumption by avoiding redundant high-frequency clock generation on each die, as the base die handles the energy-intensive reference clock processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables synchronized clock signals with reduced skew and jitter, efficient frequency scaling, and power management across large areas, addressing the challenges of clock synchronization in multi-die systems.
Implementation Method 1
resonant rings of respective rotary traveling wave oscillators (RTWOs), wherein the resonant rings of different RTWOs are shorted to one another
Data Source
AI summary
Various embodiments provide apparatuses, systems, and methods for resonant rotary clocking to generate synchronized clock signals. A base die may include a resonant ring structure to form a plurality of rotary traveling wave oscillators (RTWOs) coupled to one another in a rotary oscillator array (ROA). The ROA may provide synchronized clock signals at deterministic phase points that are tapped from the resonant ring structure. Multiple dies may be coupled to the base die (e.g., in a multi-die system) and may receive the tapped clock signals. Other embodiments may be described and claimed.