Rotary Robot Workpiece Transfer for Semiconductor Processing Footprint Reduction
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Solution Overview
Problem
Existing semiconductor processing systems face challenges with large footprints, reduced throughput, and limited integration flexibility, particularly in cluster-style and carousel-style tools, which increase costs and occupy more space in processing facilities.
Innovation Solution
A processing system with a loadlock chamber, multiple process chambers, and a rotary robot that transfers workpieces using a scissor motion between the loadlock chamber and multiple processing stations, allowing for efficient transfer and processing without vacuum or pressure breaks, enabling flexible integration of various processes like dry etch and deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If cluster-style tools with multiple processing chambers are used, then process integration capability is improved, but footprint size increases
Solution Approach 1:
The patent transitions from a horizontal arrangement of processing chambers (cluster-style) to a vertical stacking configuration. Multiple processing chambers are arranged vertically along a central rotary robot axis, allowing the system to accommodate multiple process stations within a reduced horizontal footprint while maintaining process integration capability.
Solution Approach 2:
The patent implements a nested configuration where multiple processing chambers are stacked vertically around a central rotary robot. The rotary robot is positioned at the center with processing chambers arranged in concentric or vertical layers, allowing efficient space utilization and reduced overall system footprint while maintaining access to all chambers.
2Productivity
If carousel-style tools with workpiece rotation are used, then throughput is improved, but process integration flexibility is reduced
Solution Approach 1:
The patent employs a dynamic rotary robot mechanism that can rotate to access different processing chambers and transfer workpieces flexibly. The rotary robot provides dynamic positioning capabilities, allowing the system to optimize process sequences and maintain integration flexibility while achieving high throughput through efficient workpiece rotation and transfer.
3Adaptability or versatility
If multiple robots are used for workpiece transfer, then process integration is improved, but device complexity increases
Solution Approach 1:
The patent implements a universal rotary robot design that performs multiple functions: transferring workpieces between different processing chambers, positioning workpieces at various stations, and enabling process integration. This single multi-functional robot replaces what would otherwise require multiple specialized robots, reducing system complexity while maintaining comprehensive process integration capability.
Data Source
AI summary
Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.