Rotary Substrate Holder Centrifugal Edge Clamp
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Solution Overview
Problem
Existing substrate spin rinse dryer technologies face challenges in effectively retaining and processing delicate substrates at high speeds, requiring improved methods for cleanliness and handling in rotational environments.
Innovation Solution
The implementation of a substrate holder with a counter-weighted edge clamp mechanism that utilizes centripetal force to secure substrates, eliminating the need for vacuum chucking and flippers, and featuring a rotary chuck with a movable grip member and counter spring to center and clamp the substrate at high speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum chucking and flippers are used to hold substrates, then substrate retention is achieved, but mechanical complexity and risk of residue/water spots increase
Solution Approach 1:
The patent removes vacuum chucking and flipper mechanisms from the substrate handling system, replacing them with a simplified edge clamp that uses centrifugal force generated by rotation itself to secure the substrate, thereby eliminating complex mechanical components while maintaining reliable substrate retention
Solution Approach 2:
The substrate holder utilizes the rotation of the chuck itself to generate the centrifugal force needed for substrate retention, rather than requiring separate vacuum systems or flipper mechanisms. The rotational motion serves dual purposes: both processing the substrate and providing the retention force
2Productivity
If high speed rotation is used for substrate processing, then productivity is improved, but substrate retention and cleanliness become more difficult to maintain
Solution Approach 1:
The patent changes the retention mechanism from static (vacuum) or low-speed (flipper) operation to dynamic operation that leverages high rotational speed. The edge clamp is designed to engage the substrate at low speeds and maintain retention through centrifugal force at high speeds, enabling high-speed processing while improving substrate security
3Reliability
If complex mechanical mechanisms are used for substrate handling, then substrate retention is secure, but risk of residue and water spots increases
Solution Approach 1:
By removing vacuum chucking and flipper mechanisms, the patent eliminates potential sources of contamination such as vacuum seals, O-rings, and mechanical flipper surfaces that could leave residue or cause water spots on substrates
Solution Approach 2:
The patent replaces complex mechanical retention systems with a centrifugal force-based edge clamp that has minimal contact points with the substrate, reducing mechanical interaction and potential contamination sources while maintaining secure retention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures secure and efficient processing of substrates by providing a clean, dry environment with reduced risk of residue and water spots, while minimizing mechanical complexity and maintaining high-speed rotation capabilities.
Implementation Method 1
The counter-weighted edge clamp mechanism that utilizes centripetal force to secure substrates
Implementation Method 2
The movement of substrate contact member to contact the substrate is effected by inertia effects generated by rotation of rotary chuck
Data Source
AI summary
A rotary chuck adapted to hold a substrate. The rotary chuck has a rotatable chuck portion and an edge grip having a movable grip member movably mounted to the rotatable chuck portion, the moveable grip member being substantially free moving so that rotation of the rotating chuck portion causes the moveable grip member to move in a plane substantially aligned with a surface of the substrate to engage the substrate in a engaged position. A resilient element is coupled to the moveable grip member, the resilient member biasing the grip member to a disengaged position.