Rotary Substrate Holder Layout for Multi-Liquid Wafer Processing
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Solution Overview
Problem
Conventional single substrate processing type substrate processing apparatuses have limited flexibility in handling various types of processing due to having only one processing position in a chamber.
Innovation Solution
A substrate processing apparatus with a chamber, substrate holding portion, and turning mechanism that allows substrates to be processed at multiple positions using different processing liquids, including an immersion bath and a moving mechanism to transfer substrates between these positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single substrate processing type substrate processing apparatus with one processing position is used, then the apparatus size can be reduced and processing liquid consumption can be minimized, but the apparatus cannot handle various types of processing
Solution Approach 1:
The processing chamber is divided into multiple processing positions (first processing position with first processing liquid, second processing position with second processing liquid, etc.), allowing different processing operations to be performed simultaneously in separate locations. The substrate holding portion sequentially transfers substrates to each processing position, enabling versatile processing without requiring multiple separate chambers.
Solution Approach 2:
A single substrate holding portion serves multiple functions by sequentially transferring substrates to different processing positions for different types of processing. The turning mechanism enables the substrate holding portion to access multiple processing positions, making one component perform multiple processing tasks that would otherwise require separate apparatuses.
2Adaptability or versatility
If multiple processing positions are added to handle various processing types, then processing versatility improves, but the apparatus size increases
Solution Approach 1:
Instead of arranging multiple processing positions in a single linear sequence that would increase chamber length, the positions are arranged in a circular pattern around the turning axis. This two-dimensional circular arrangement allows multiple processing positions to be accessed by rotation, reducing the linear footprint of the chamber while maintaining processing versatility.
Solution Approach 2:
Multiple processing positions and their respective processing liquids are combined within a single chamber space. The substrate holding portion acts as a shared resource that sequentially serves all processing positions, merging what would traditionally require separate processing chambers into one compact unit.
3Adaptability or versatility
If substrates are transferred between multiple processing positions, then various processing types can be performed, but particle transfer between substrates may occur
Solution Approach 1:
The substrate holding portion is extracted from the processing positions after substrate transfer is complete. By removing the substrate holding portion from the processing positions, the risk of particle transfer between substrates is eliminated, as particles cannot be transferred when the holding portion is not present at the processing positions.
Solution Approach 2:
Substrates are fully processed at each processing position before being transferred to the next position. The substrate holding portion completes all necessary processing operations at one position before moving to the next, ensuring that no particles are transferred during intermediate states. The sequential processing approach ensures that each substrate is completely handled at each position before transition.
Data Source
AI summary
A substrate processing apparatus includes a chamber, a substrate holding portion, and a turning mechanism. The chamber has a first opening through which an inside and an outside communicate with each other and a substrate is carried in, and a second opening through which the inside and the outside communicate with each other and the substrate is carried out. The substrate holding portion is disposed in the chamber and holds the substrates one by one. The turning mechanism turns the substrate holding portion to move the substrate holding portion between a plurality of processing positions at which the substrate is processed with a processing liquid in the chamber.


