Rotary Substrate Thinning With Closed-Loop Tilt Control
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Solution Overview
Problem
Existing substrate grinding apparatuses face challenges in controlling thickness distribution and tilt angle adjustments during multiple grinding stages, leading to inconsistencies in substrate thickness and efficiency.
Innovation Solution
A substrate processing apparatus with a rotary table, substrate chucks, and tilt angle adjusting device that allows for precise control of tilt angles and thickness measurements at multiple points, enabling uniform substrate thinning across different processing stages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If tilt angle adjustment is performed based on thickness measurements, then manufacturing precision of substrate thickness distribution is improved, but device complexity increases due to additional measurement and control mechanisms
Solution Approach 1:
The system measures the thickness distribution of the substrate at multiple points using a thickness measurement device, then feeds this information back to the tilt angle adjusting device. The tilt angle is adjusted based on the measurement results to control the thickness distribution, forming a closed-loop feedback control system that improves manufacturing precision.
Solution Approach 2:
The patent replaces manual or mechanical tilt angle adjustment with an automated control system that uses measurement data to automatically adjust the tilt angle. This substitution of mechanical adjustment with automated control based on measurement feedback reduces the complexity of manual operation while improving precision.
2Productivity
If multiple substrate chucks are arranged around the rotary table, then productivity is improved through parallel processing, but manufacturing precision deteriorates due to difficulty in controlling consistent tilt angles across multiple chucks
Solution Approach 1:
The patent applies local quality by providing individual tilt angle adjusting devices for each substrate chuck position around the rotary table. Each chuck can have its tilt angle independently adjusted based on local thickness measurement requirements, allowing consistent precision across multiple parallel processing positions.
Solution Approach 2:
The system changes the tilt angle parameter for each substrate chuck based on measured thickness distribution data. By dynamically adjusting the tilt angle parameter for each position, the system maintains consistent manufacturing precision across multiple chucks while enabling parallel processing.
3Manufacturing precision
If thickness measurement is performed at multiple points in the diametrical direction, then manufacturing precision is improved through better thickness distribution control, but measurement time increases
Solution Approach 1:
The system performs preliminary thickness measurements at multiple points before the substrate undergoes complete processing. These preliminary measurements allow for early detection of thickness distribution issues and enable proactive tilt angle adjustments, preventing the need for extensive rework and reducing overall measurement and processing time.
Data Source
AI summary
A substrate processing apparatus includes a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed; a tilt angle adjusting device configured to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position; and a tilt angle controller configured to control the tilt angle adjusting device based on a measurement result of aa plate thickness measuring device. The plate thickness measuring device measures a plate thickness of the substrate at the carry-out position.