Rotary Table Cleaning via Dual-Position Gas Flow
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Solution Overview
Problem
In film deposition apparatuses, the narrow gap between cleaning gas nozzles and rotary tables leads to high cleaning gas flow rates, increasing cleaning time and variability in removing films from different surfaces of the rotary table.
Innovation Solution
A method involving two cleaning processes with the rotary table in different positions, where a cleaning gas is supplied from above the substrate-mounting surface while rotating at a first and second cleaning position, optimizing gas flow rates to efficiently remove films from all surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If cleaning gas is supplied from a nozzle with a narrow gap to the rotary table, then the cleaning gas flow rate becomes high, but the cleaning time increases and cleaning uniformity deteriorates
Solution Approach 1:
The cleaning process is divided into two distinct stages: a first cleaning process with the nozzle close to the rotary table for efficient film removal, and a second cleaning process with the nozzle retracted for uniform cleaning of all surfaces. This segmentation allows optimization of gas flow rate and cleaning time in different phases.
Solution Approach 2:
The nozzle position is made dynamic rather than fixed. The nozzle moves between a first position (close to the rotary table) and a second position (retracted), allowing the system to adapt the cleaning gas flow characteristics to the specific cleaning requirements at different stages.
2Quantity of substance
If cleaning gas is supplied from a nozzle with a narrow gap to the rotary table, then the cleaning gas flow rate becomes high, but cleaning uniformity across different surfaces deteriorates
Solution Approach 1:
The cleaning process is divided into two distinct stages: a first cleaning process with the nozzle close to the rotary table for efficient film removal, and a second cleaning process with the nozzle retracted for uniform cleaning of all surfaces. This segmentation allows optimization of gas flow rate and cleaning time in different phases.
Solution Approach 2:
The cleaning process uses periodic action by alternating between two cleaning positions. The nozzle periodically moves between the first position (for high flow rate cleaning) and the second position (for uniform cleaning), ensuring both efficiency and uniformity are achieved through cyclic operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces cleaning time and ensures uniform cleaning of the rotary table by adjusting gas flow rates based on surface-specific film thickness, enhancing the efficiency of film removal.
Implementation Method 1
a cleaning gas is routinely supplied into a process chamber to remove the film deposited on the upper surface, the side surface, and the lower surface of the rotary table
Data Source
AI summary
A method performed by a film deposition apparatus including a process chamber and a rotary table that is disposed in the process chamber and includes a substrate-mounting surface on which a substrate is placeable. The method includes a first cleaning process of supplying a cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a first cleaning position, and a second cleaning process of supplying the cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a second cleaning position that is lower than the first cleaning position.