Rotary Table Cleaning by Alternating Carrier Gas Flow
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Solution Overview
Problem
In film deposition apparatuses, periodic cleaning is necessary to remove deposited films from rotary tables, but existing methods may not uniformly remove films across the surface, potentially leading to particle production and surface irregularities.
Innovation Solution
A cleaning method involving a gas injector that alternates the flow rate of a carrier gas and cleaning gas while rotating the rotary table, adjusting flow rates based on the position of mounting areas to uniformly etch the deposited film, preventing surface exposure and shape changes during the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cleaning gas is supplied to the rotary table to remove the deposited film, then the film is removed from the rotary table, but the film removal may be non-uniform causing particles and surface irregularities
Solution Approach 1:
The gas injector dynamically adjusts the carrier gas flow rate between a first flow rate (when mounting areas are in the gas flow path) and a second flow rate (when mounting areas are not in the gas flow path). This dynamic adjustment ensures uniform cleaning across the rotary table surface by preventing excessive gas flow from causing non-uniform film removal and particle generation, while maintaining effective cleaning when areas are exposed to the gas flow.
2Reliability
If the carrier gas flow rate is maintained at a high level continuously, then the cleaning gas can effectively reach the rotary table surface, but excessive gas flow may cause non-uniform film removal and surface exposure
Solution Approach 1:
The system employs periodic action by switching the carrier gas flow rate between a first flow rate (higher) and a second flow rate (lower) based on the rotational position of the rotary table. When mounting areas enter the gas flow path, the flow rate increases to ensure effective cleaning gas delivery. When mounting areas rotate out of the flow path, the flow rate decreases to prevent excessive gas impact that could cause surface exposure or non-uniform film removal. This periodic adjustment maintains both cleaning effectiveness and surface integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures uniform film removal across the rotary table, preventing particle production and surface irregularities, thereby maintaining apparatus integrity and efficiency.
Implementation Method 1
a cleaning method includes (a) discharging a carrier gas and a cleaning gas from the gas injector into the processing chamber with rotating the rotary table
Data Source
AI summary
With respect to a cleaning method of cleaning an inside of a processing chamber in a film deposition apparatus including a rotary table rotatably provided in the processing chamber, multiple mounting areas being provided on the rotary table in a circumferential direction, the cleaning method includes (a) discharging a carrier gas and a cleaning gas with rotating the rotary table, a flow rate of the carrier gas being adjusted to a first flow rate, (b) discharging the carrier gas and the cleaning gas with rotating the rotary table, the flow rate of the carrier gas being adjusted to a second flow rate less than the first flow rate, and (c) performing switching from (a) to (b) and switching from (b) to (a) a predetermined number of times while the rotary table rotates by one revolution, the predetermined number being equal to a number of the multiple mounting areas.