Rotatable Adhesive Dispenser Head for High-Speed Die Bonding
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Solution Overview
Problem
Existing die bonding processes are limited by the need for powerful drive systems and robust bearings to accelerate large masses, constraining the speed of adhesive dispensing and thereby the production rate.
Innovation Solution
An adhesive dispenser with a rotatable head conveyor system that uses a combination of linear and rotary positioning motors to move the dispenser head along orthogonal axes, reducing the mass to be accelerated and the power required, allowing for higher acceleration rates and increased throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If orthogonal drives are used to move the adhesive dispenser head to dispensing positions, then the dispenser head can be positioned accurately, but large masses need to be accelerated requiring powerful drive systems and robust bearings which limits maximum acceleration values
Solution Approach 1:
The patent transforms the traditional two-dimensional orthogonal movement system into a three-dimensional system by adding a rotational degree of freedom. The dispenser head can now rotate about a vertical axis in addition to moving along horizontal axes, allowing the system to reach dispensing positions from multiple directional approaches. This dimensional addition enables the use of smaller, lighter drive components since the rotational mechanism requires less force to reposition the head compared to accelerating large masses in orthogonal directions.
2Measurement precision
If orthogonal drives are used to convey the adhesive dispenser head, then positioning can be achieved, but relatively large masses need to be accelerated requiring powerful drive systems
Solution Approach 1:
By introducing rotational movement as an additional dimension, the system can achieve positioning without requiring powerful linear drives. The rotational axis allows the dispenser head to be repositioned by rotating rather than by accelerating large masses linearly, significantly reducing the power requirements of the drive system while maintaining positioning accuracy.
3Reliability
If robust bearings are used to support the adhesive dispenser head, then the system can handle large masses, but the maximum acceleration values are limited
Solution Approach 1:
The rotational degree of freedom provides an alternative motion path that requires smaller forces to achieve the same repositioning effect. This allows the use of lighter bearings that can support the reduced loads while still enabling high acceleration rates, as the rotational mechanism inherently requires less force to change the position of the dispenser head.
4Productivity
If dual head dispensing systems are used to increase throughput, then more adhesive can be dispensed simultaneously, but the complexity of the system increases
Solution Approach 1:
The patent makes the dispenser head dynamically reconfigurable by adding rotational capability. Instead of using multiple static heads, a single head can dynamically reposition itself by rotating to access different dispensing locations. This dynamic approach achieves increased throughput equivalent to multiple heads while maintaining the simplicity of a single-head system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables faster adhesive dispensing and higher production rates by reducing the load on bearings and allowing smaller, more efficient drive systems, resulting in improved acceleration and settling times.
Implementation Method 1
a first linear positioning motor operative to convey the adhesive dispenser head along the first axis
Implementation Method 2
a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head
Data Source
AI summary
An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.


