Rotatable Bonding Stage for Precise Display Substrate Alignment
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Solution Overview
Problem
Existing display device manufacturing processes often cause damage to substrates and fail to maintain optimal alignment during the bonding process.
Innovation Solution
A bonding device and method that includes a transport unit, a carrier with a substrate tray, a rotatable bonding stage, a support, and a gripper to prevent substrate damage and improve alignment by controlled movement and positioning of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding process is used without specialized support structures, then the bonding process can be completed, but the substrate may be damaged due to improper support and alignment
Solution Approach 1:
The bonding device is divided into functionally independent components: a transport unit for substrate conveyance, a rotatable bonding stage for positioning, and a support structure with gripper for substrate holding. Each component performs a specific function, allowing the system to achieve reliable substrate damage prevention through coordinated operation of segmented parts rather than requiring a monolithic complex structure.
Solution Approach 2:
The support structure acts as an intermediary between the bonding stage and the substrate. It provides a controlled interface for holding and positioning the substrate during bonding, preventing direct contact that could cause damage while enabling precise alignment. The gripper component serves as an intermediary mechanism to securely hold the substrate without causing damage.
2Manufacturing precision
If the substrate is held firmly during bonding to prevent movement, then alignment can be maintained, but the substrate may be damaged due to excessive force or improper handling
Solution Approach 1:
The support structure provides localized support at specific positions on the substrate rather than uniform constraint across the entire substrate. The gripper applies force only at the edges or designated holding areas, allowing the rest of the substrate to remain stable without experiencing excessive constraint forces that could cause damage. This localized approach maintains alignment while minimizing harmful effects.
Solution Approach 2:
The bonding stage and support structure are designed with cushioning characteristics that absorb and distribute forces during the bonding process. The rotatable bonding stage allows controlled movement with force absorption, preventing sudden impacts or excessive forces from damaging the substrate while maintaining sufficient holding force for alignment.
3Manufacturing precision
If the bonding stage is fixed in position to ensure stable bonding, then the bonding process is simple, but the substrate alignment precision is reduced
Solution Approach 1:
The bonding stage is designed to be rotatable rather than fixed, allowing dynamic adjustment of the substrate position and orientation during the bonding process. This enables precise alignment of the substrate with the bonding area while maintaining operational simplicity. The rotatable mechanism provides the necessary degrees of freedom for alignment without requiring overly complex positioning systems.
Solution Approach 2:
The support structure and bonding stage are pre-configured with alignment features and positioning mechanisms that establish precise substrate alignment before the bonding process begins. The rotatable bonding stage can be pre-positioned at the correct orientation, and the support structure can be pre-adjusted to hold the substrate in the optimal position, eliminating the need for complex real-time adjustments during bonding.
Data Source
AI summary
A bonding device includes a transport unit, a carrier movable on and along the transport unit and having a substrate tray accommodated therein, a rotatable bonding stage disposed on the transport unit, a support disposed on the bonding stage and movable on the bonding stage along an upstream direction of the transport unit, a downstream direction of the transport unit, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotation direction toward the upstream direction, and a second rotation direction toward the downstream direction and a gripper connected to the support so as to be disposed between the support and the bonding stage.