Rotatable Bracket Venting for Portable Electronic Cooling

Solution Overview

Problem

Conventional electronic devices face challenges in heat dissipation efficiency due to insufficient air flow and bulky external heat dissipation brackets that compromise portability.

Innovation Solution

An electronic device with an adjustable bracket component that can switch between closed and open modes, allowing for ergonomic positioning and enhanced heat dissipation by adjusting the included angle between the device and a plane.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If foot pads are used to elevate the logic body, then air circulation space is created, but the gap is excessively small resulting in insufficient air flow

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidair flow

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The bracket component is designed to be rotatable rather than fixed, allowing it to dynamically adjust between a first position (providing ergonomic support) and a second position (providing enhanced heat dissipation). This dynamic adjustment enables the system to optimize air flow when needed while maintaining portability when not in use.

Inventive Principle:

Principle #15Dynamics

2Temperature

If an external heat dissipation bracket is used to enhance heat dissipation, then heat dissipation efficiency is improved, but the bulky volume compromises user portability

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidportability

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat dissipation bracket is integrated directly into the logic body structure rather than being a separate external accessory. This merging eliminates the need for bulky external brackets while providing the same heat dissipation function, thereby maintaining portability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bracket component is designed to be rotatable rather than fixed, allowing it to dynamically adjust between a first position (providing ergonomic support) and a second position (providing enhanced heat dissipation). This dynamic adjustment enables the system to optimize air flow when needed while maintaining portability when not in use.

Inventive Principle:

Principle #15Dynamics

3Temperature

If the bracket component is unfolded to increase heat dissipation space, then heat dissipation efficiency is improved, but the device volume increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice volume

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The bracket component is designed to be rotatable rather than fixed, allowing it to dynamically adjust between a first position (providing ergonomic support) and a second position (providing enhanced heat dissipation). This dynamic adjustment enables the system to optimize air flow when needed while maintaining portability when not in use.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves heat dissipation efficiency while maintaining portability by optimizing air intake and exhaust in different usage scenarios, enabling extended use of the device without bulkiness.

Implementation Method 1

the built-in heat dissipation fin is positioned to make contact with the heat source and absorbs energy of the heat source

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

ambient cold air is drawn into the logic body by a fan to engage in a heat exchange with the heat dissipation fin to dissipate heat

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

ambient cold air is drawn into the logic body by a fan to engage in a heat exchange with the heat dissipation fin

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS12563702B2Electronic device

Publication Date: 2026.02.24 COMPAL ELECTRONICS INC

AI summary

An electronic device includes a logic body, a processing unit, and a bracket component. The logical body has a plurality of first end openings and a plurality of first bottom openings. The first end openings are disposed at a first end portion of the logic body. The first bottom openings are disposed at a bottom portion of the logic body and are adjacent to the first end portion. The processing unit is disposed in an interior of the logic body, away from the first end openings, and misaligned with the first bottom openings. The bracket component is rotatably disposed at the bottom portion. In a closed mode, the bracket component is positioned close to the bottom portion and covers the first bottom openings. In an open mode, the bracket component is unfolded from the bottom portion and exposes the first bottom openings.