Rotatable Cathode Targets for Multi-Material Sputtering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sputtering apparatuses face challenges in efficiently handling complex layer stacks and switching between different materials, requiring additional equipment and resulting in reduced production efficiency and increased costs due to the need for multiple chambers and lengthy reconfiguration processes.
Innovation Solution
A sputtering apparatus with a rotatable yoke system that allows for the selective reconfiguration of targets within the same chamber, enabling the use of multiple target materials without venting the chamber, by rotating targets to active and inactive positions, allowing for efficient switching between different sputtering modes and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sputtering chambers are added to handle complex layer stacks, then the capability to deposit different materials is improved, but the equipment cost and space requirements increase
Solution Approach 1:
The patent implements a universal sputtering chamber that can handle multiple target materials and deposition modes through a single chamber design. The rotatable cathode assembly allows the same chamber to switch between different target configurations, eliminating the need for multiple specialized chambers while maintaining the capability to deposit various materials.
Solution Approach 2:
The patent employs a dynamic rotatable cathode assembly that can change its configuration during operation. The cathode rotates to bring different targets into the sputtering position, allowing the system to adapt between different materials and deposition modes without requiring physical reconfiguration or additional chambers.
2Device complexity
If conventional sputtering apparatuses use fixed targets, then the apparatus structure is simple, but the reconfiguration process requires venting and cooling which reduces production efficiency
Solution Approach 1:
The patent replaces fixed targets with a rotatable cathode assembly that can dynamically switch between different targets. This dynamic configuration allows targets to be rotated into or out of the sputtering position without venting the chamber or cooling the system, maintaining vacuum conditions and enabling continuous production.
Solution Approach 2:
The patent pre-configures multiple targets on the rotatable cathode assembly before operation. All targets are prepared and positioned in advance on the rotating mechanism, allowing immediate switching between materials by simply rotating the assembly, eliminating the need for time-consuming reconfiguration procedures.
3Productivity
If multiple chambers are used to avoid reconfiguration downtime, then production efficiency is improved, but the equipment cost increases
Solution Approach 1:
The patent creates a universal chamber that can handle all target materials and deposition modes through a single multi-functional design. The rotatable cathode assembly provides access to multiple targets within one chamber, eliminating the need for multiple specialized chambers while maintaining continuous production capability.
Solution Approach 2:
The patent enables continuous sputtering operation by keeping the chamber under vacuum throughout the target switching process. The rotatable cathode assembly allows targets to be exchanged or repositioned without breaking the vacuum, ensuring the sputtering process can continue without interruption or downtime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient switching between different target materials and modes without the need for additional chambers, reducing equipment costs and increasing production efficiency by allowing continuous operation with minimal downtime for reconfiguration.
Implementation Method 1
The ejection of the target material is accomplished by bombarding the surface of the target with gas ions accelerated by a high voltage. Particles are ejected from the target as a result of momentum transfer between the accelerated gas ions and the target.
Implementation Method 2
sputter coating is a thin film coating process that involves the transport of almost any material from a target to a substrate of almost any other material
Implementation Method 3
One known technique for enhancing conventional sputtering processes involves arranging magnets behind or near the target to influence the path taken by electrons within the sputtering chamber, thereby increasing the frequency of collisions with sputtering gas atoms or molecules.
Data Source
AI summary
Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source.