Rotatable Cathode Unit for Multilayer Film Sputtering
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Solution Overview
Problem
Conventional sputtering apparatuses have short maintenance cycles and limited target area due to small target size, leading to inefficient multilayer film formation with spiral patterns due to rotating magnet units and frequent power supply interruptions.
Innovation Solution
A multilayer-film sputtering apparatus with a rotatable cathode unit having multiple targets arranged on the same circumference, equipped with a sensor for position detection and a power-supply mechanism, allowing continuous film formation without interruptions by distinguishing and controlling the discharge of each cathode based on its position and rotation angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a rotating magnet unit is used in conventional sputtering apparatus, then the target area is limited and small, but the multilayer film formation is achieved
Solution Approach 1:
The cathode unit is divided into multiple independent cathodes (first cathode and second cathode) arranged side by side, each capable of independent discharge control. This segmentation allows simultaneous or sequential film formation from multiple targets, eliminating the limitation of small target area while maintaining multilayer film formation capability.
Solution Approach 2:
Multiple cathodes are merged into a single cathode unit that rotates together, combining the functionality of multiple targets while sharing a common rotation mechanism. This approach increases the effective target area without requiring multiple separate rotating units, thereby improving productivity.
2Productivity
If the cathode unit rotates continuously, then the film formation can proceed, but spiral patterns are formed on the substrate
Solution Approach 1:
The discharge of each cathode is controlled periodically based on its rotational position. By detecting the rotation angle and selectively discharging the first or second cathode at appropriate intervals, uniform film thickness is achieved without spiral patterns, while maintaining continuous film formation through alternating cathode activation.
Solution Approach 2:
A rotation detection mechanism provides real-time feedback on the cathode unit's rotational position. This feedback enables the control system to determine when each cathode is in the optimal position for discharge, ensuring uniform film deposition by activating cathodes only when they are correctly oriented relative to the substrate.
3Adaptability or versatility
If power supply is interrupted frequently for multilayer film formation, then different layers can be deposited, but treatment time increases
Solution Approach 1:
The rotation of the cathode unit continues continuously without interruption throughout the multilayer film formation process. Power supply to specific cathodes is controlled based on rotational position, but the mechanical rotation itself never stops, eliminating time losses associated with starting and stopping rotation and maintaining continuous useful action.
Solution Approach 2:
The cathode unit is pre-configured with multiple cathodes positioned at specific angular intervals. This preliminary arrangement allows the control system to predict when each cathode will be in the optimal discharge position, enabling seamless transitions between layers without interrupting the overall process, thereby reducing treatment time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves target utilization efficiency and eliminates spiral patterns, enabling high-productivity multilayer film formation with uniform thickness and reduced treatment time.
Implementation Method 1
a sputtering apparatus which has: a cathode unit which can be rotated; a power-supply mechanism for supplying power to the cathode unit; and a rotation detection mechanism for detecting a rotation angle of the cathode unit
Implementation Method 2
discharge is generated on both sides of a carrier unit
Data Source
AI summary
Provided is a sputtering apparatus which can form a multilayer film giving high productivity and with less spiral pattern by effective use of targets, and a method of forming multilayer film using the apparatus. An embodiment is a multilayer-film sputtering apparatus comprising: a rotatable cathode unit (30) having cathodes (7a and 7b) arranged on the same circumference with respect to the rotational center, and having a power-supply mechanism for supplying power to each cathode; a sensor (14) for detecting the position of cathode; and a rotation mechanism for rotating the cathode unit (30).


