Rotatable Coolant Manifold Section for Server Heat Dissipation

Solution Overview

Problem

The increasing power dissipation in integrated circuit chips poses a cooling challenge, particularly in data centers where traditional air-cooling methods are insufficient, leading to stress on room air-conditioning systems and limitations in handling high heat fluxes, especially in large server farms.

Innovation Solution

A cooling apparatus featuring a coolant-cooled structure with a rotatable manifold section that allows for the detachment of coolant-cooled structures from electronic components while maintaining fluid communication, facilitating the use of rigid conduits and enabling in-field replacement of components without disrupting the entire cooling system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional air-cooling methods are used to cool integrated circuit chips, then the cooling system is simple to implement, but the cooling efficiency is insufficient to handle high power dissipation and high heat fluxes

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcooling system complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent transitions from air-cooling to liquid-cooling by introducing a coolant circulation system with pumps, manifolds, and coolant-cooled structures. Liquid coolant flows through channels in direct contact with electronic components, providing superior heat transfer efficiency compared to air cooling, while managing the increased system complexity through structured hydraulic architecture.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Loss of energy

If liquid cooling is implemented to manage high heat fluxes, then cooling efficiency is improved, but the system complexity increases and requires additional infrastructure

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcooling infrastructure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The cooling system is divided into modular segments including separate manifolds for different coolant flows (first coolant and second coolant), individual coolant-cooled structures for different electronic components, and distributed cooling paths. This segmentation allows independent optimization of each module and simplifies maintenance and scalability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The manifold structure serves multiple functions: distributing coolant to multiple coolant-cooled structures, collecting coolant from these structures, and enabling selective isolation of individual cooling paths. The rotatable manifold sections provide both fluid distribution and mechanical positioning capabilities, reducing the need for separate actuation mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If coolant-cooled structures are made rigid for stable cooling, then cooling performance is consistent, but component replacement and system flexibility are reduced

Engineering Contradiction:

Improvecooling performance stabilityVSAvoidcomponent replaceability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The manifold incorporates rotatable sections that can rotate relative to fixed portions, enabling dynamic reconfiguration of coolant flow paths. This rotational capability allows the system to adapt to different component positions and facilitates the detachment and replacement of coolant-cooled structures while maintaining sealed fluid connections, thus providing both stability during operation and flexibility during maintenance.

Inventive Principle:

Principle #15Dynamics

4Ease of manufacture

If the cooling system is designed as a fixed integrated structure, then manufacturing is simplified, but in-field component replacement and maintenance become difficult

Engineering Contradiction:

Improvesystem integrationVSAvoidcomponent replacement

Core Design Contradiction:

Ease of manufactureVSEase of repair

Solution Approach 1:

The cooling system is divided into modular segments including separate manifolds for different coolant flows (first coolant and second coolant), individual coolant-cooled structures for different electronic components, and distributed cooling paths. This segmentation allows independent optimization of each module and simplifies maintenance and scalability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The manifold incorporates rotatable sections that can rotate relative to fixed portions, enabling dynamic reconfiguration of coolant flow paths. This rotational capability allows the system to adapt to different component positions and facilitates the detachment and replacement of coolant-cooled structures while maintaining sealed fluid connections, thus providing both stability during operation and flexibility during maintenance.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages high heat fluxes by allowing for efficient coolant circulation and component replacement, enhancing cooling efficiency and reducing the need for extensive system replacement, thereby improving data center cooling capabilities and operational flexibility.

Implementation Method 1

The liquid absorbs the heat dissipated by the components/modules in an efficient manner

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The one coolant conduit is also coupled in fluid communication with a respective rotatable manifold section to facilitate flow of coolant through the at least one coolant-cooled channel

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8922998B2Coolant manifold with separately rotatable manifold section(s)

Publication Date: 2014.12.30 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.