Rotatable Device Thermal Management via Sensor State Adaptation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current thermal management systems in compact electronic devices face challenges in accurately controlling temperature, leading to potential overheating and reduced performance due to the thermal lag compared to electrical response, and safety concerns when the user cannot contact certain surfaces.
Innovation Solution
A multi-display computing device with rotatable portions and sensors that adjust thermal management based on the device's orientation, deactivating temperature sensors at positions the user cannot contact when in a closed position to prevent overheating and optimize cooling, allowing higher power operation safely.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal management systems continuously monitor all temperature sensors to prevent overheating, then device safety is improved, but system performance is reduced due to thermal lag causing premature throttling
Solution Approach 1:
The thermal management system dynamically adjusts which temperature sensors are active based on the device's operational state. When the device is in a state where certain surfaces are not user-contactable, the system deactivates corresponding temperature sensors, allowing higher power operation without premature throttling. This dynamic adaptation resolves the contradiction by making the monitoring system flexible rather than static.
Solution Approach 2:
The system applies different thermal management strategies to different regions of the device. Temperature sensors are selectively deactivated based on their spatial location and the device's current configuration. Surfaces that are not accessible to users can tolerate higher temperatures, while user-contactable surfaces maintain strict temperature control. This local differentiation allows performance optimization without compromising overall safety.
2Productivity
If the device operates at higher power to improve performance, then productivity is improved, but thermal management becomes more challenging leading to potential overheating
Solution Approach 1:
The system changes the operational parameters of temperature sensors based on device state. When the device is in a closed configuration where certain surfaces are not user-contactable, the system raises the effective temperature threshold for those regions by deactivating the corresponding sensors. This parameter change allows higher power operation and increased performance without causing overheating of user-contactable surfaces.
3Productivity
If temperature sensors are deactivated to allow higher power operation, then system performance is improved, but temperature monitoring precision is reduced
Solution Approach 1:
The system maintains high temperature monitoring precision for user-contactable surfaces while deactivating sensors for non-contactable surfaces. This selective approach ensures that measurement precision is preserved where it matters most (user safety) while allowing performance optimization in regions where temperature monitoring is less critical.
Solution Approach 2:
The temperature monitoring system dynamically adjusts its precision level based on device state. When the device transitions to a configuration where certain surfaces become user-contactable, the system reactivates the corresponding temperature sensors to restore precise monitoring. This dynamic adjustment resolves the contradiction by making measurement precision adaptive rather than fixed.
4Volume of moving object
If the device uses a compact design to reduce size, then portability is improved, but thermal management becomes more difficult due to limited cooling space
Solution Approach 1:
The compact device uses dynamic thermal management that adapts to its operational state. When the device is in a closed configuration, the system deactivates certain temperature sensors and allows higher operating temperatures, effectively compensating for the limited cooling space. This dynamic adaptation allows the compact design to maintain performance without requiring proportionally larger cooling systems.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.