Rotatable Die-Substrate Layout for Shorter SerDes Trace Routing
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Solution Overview
Problem
ASIC development incurs higher upfront costs and often results in inefficient usage of dies due to reduced SerDes channel numbers in cost-sensitive products, leading to suboptimal performance and manufacturing inefficiencies.
Innovation Solution
Configuring a die into multiple rotational states with bifurcated slices and a substrate that accommodates SerDes channels in compressed configurations, allowing for reduced trace lengths and efficient utilization of functional slices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If SerDes channel numbers are reduced in cost-sensitive products, then manufacturing costs are reduced, but performance and communication efficiency deteriorate
Solution Approach 1:
The die is bifurcated into two separate slices, each capable of independent operation with its own SerDes channels. This segmentation allows the system to utilize either slice individually (reducing cost by using fewer channels) or both slices together (improving performance), thereby resolving the contradiction between cost reduction and performance maintenance.
2Reliability
If trace lengths are reduced, then signal integrity and communication efficiency improve, but manufacturing complexity increases
Solution Approach 1:
The substrate is configured to couple with the die at multiple orientations (0 degrees and 180 degrees), utilizing dimensional flexibility to achieve shorter trace lengths. By allowing rotational coupling options, the design can optimize trace routing geometry without fundamentally changing the manufacturing process, thus improving signal integrity while maintaining manufacturing feasibility.
Data Source
AI summary
Devices, systems, methods, and processes for allowing for the orientation of a die within a processing unit to be rotated while still maintaining suitable communication channels. During manufacturing, dies may be configured into multiple slices. Some of these slices may end up becoming non-functional due to a defect or other condition. However, a remaining functional slice may still be utilized and coupled to a substrate. The die can be configured such that the communication channels are available on one specific section of the die, even if it is rotated. Likewise, the substrate can also be configured to compress the location of the corresponding communication channels into a smaller area closer to that specific section. In this way, shorter trace lines can be made increasing performance and reducing manufacturing costs. Thus, the die can be rotated depending on which slice is functional, and still be suitable for coupling to the substrate.