Rotatable Electrostatic Chuck with Removable Pedestal
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Solution Overview
Problem
Conventional electrostatic chucks are limited in movement and require part changes when switching between high and low temperature processes, leading to non-uniform deposition and reduced throughput due to vacuum seal breaks.
Innovation Solution
A rotatable, heated electrostatic chuck with a substrate support pedestal that includes dielectric chucking electrodes, gas distribution grooves, and a removable pedestal design for quick temperature process switching, allowing DC power coupling and improved backside gas distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrostatic chucks are used with fixed vertical movement only, then the structure is simple and easy to manufacture, but deposition uniformity deteriorates due to off-axis target positioning
Solution Approach 1:
The electrostatic chuck is modified to enable rotational movement in addition to vertical movement. The chuck can rotate to different angular positions to align with off-axis targets during deposition, transforming from a static vertical-only movement system to a dynamic system with multiple degrees of freedom, thereby achieving uniform deposition while maintaining structural feasibility
2Productivity
If the pedestal is bonded to the electrostatic chuck as a single unit, then the structure is simple and robust, but throughput deteriorates when switching between high and low temperature processes due to vacuum seal breaks
Solution Approach 1:
The previously bonded single-unit structure is segmented into separable components: the pedestal and the electrostatic chuck become distinct elements that can be independently handled. This allows the electrostatic chuck to remain in place while the pedestal is quickly exchanged between temperature processes, maintaining vacuum seals and enabling rapid process switching without breaking vacuum
3Adaptability or versatility
If multiple parts are changed when switching between low and high temperature processes, then temperature adaptability is achieved, but time is lost due to part changes and vacuum seal breaks
Solution Approach 1:
The system is divided into temperature-adaptable modular components where only the pedestal needs to be changed for temperature process switching. The electrostatic chuck remains stationary and reusable, eliminating the need to change multiple parts and avoiding vacuum seal breaks, thus reducing process switching time while maintaining temperature adaptability
Solution Approach 2:
The electrostatic chuck is designed as a universal component that can work with both low temperature and high temperature processes without modification. By making the chuck temperature-universal and only requiring pedestal changes, the system achieves multi-process compatibility while minimizing downtime and part changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform deposition across substrates during off-axis processes and increases throughput by allowing quick pedestal swaps between temperature processes without breaking vacuum seals.
Implementation Method 1
An electrostatic chuck is often used to electrostatically retain a substrate on a substrate support during the deposition process
Implementation Method 2
the expansion opening has a second diameter larger than the first diameter to allow gas passing through the channel to expand into the expansion opening before flowing through the plurality of gas holes
Data Source
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AI summary
Embodiments of a substrate support pedestal and an electrostatic chuck incorporating same are disclosed herein. In some embodiments, a substrate support pedestal includes: a body having an upper surface and a lower surface opposite the upper surface; one or more chucking electrodes disposed within the body; a plurality of substrate support elements protruding from the upper surface to support a substrate; a hole disposed in the lower surface at a center of and partially through the body; a plurality of gas holes disposed in the upper surface proximate the center of the body, wherein the plurality of gas holes is disposed above and fluidly coupled to the hole; and a plurality of gas distribution grooves formed in the upper surface and fluidly coupled to the plurality of gas holes.