Rotatable Electrostatic Chuck RF Coupling
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Solution Overview
Problem
Conventional electrostatic chucks are limited to vertical movement, preventing their use in off-axis deposition processes due to non-uniform deposition on substrates, which is a challenge in microelectronic device fabrication requiring rotation and heating during physical vapor deposition.
Innovation Solution
A rotatable electrostatic chuck with a RF coupling device that includes a conductive plate, a rotatable split cylinder, RF input taps, a stationary ring, and a grounded shield, allowing for RF power delivery to RF bias electrodes while enabling substrate rotation and heating, thus improving deposition uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrostatic chucks are used with vertical movement only, then substrate retention is achieved, but deposition uniformity deteriorates due to inability to rotate
Solution Approach 1:
The electrostatic chuck is enabled to rotate dynamically around a vertical axis in addition to its vertical movement capability. The rotation assembly includes a motor coupled to a shaft that extends through the chuck, allowing the substrate to be rotated during deposition processes to achieve uniform coating across the entire substrate surface.
2Manufacturing precision
If RF power is delivered to rotating electrostatic chuck, then deposition uniformity improves, but electrical coupling complexity increases
Solution Approach 1:
An RF coupling device serves as an intermediary between the stationary RF power source and the rotating electrostatic chuck. This coupling device includes capacitive coupling elements that allow RF power to be transmitted to the chuck without requiring direct electrical connections that would complicate the rotating interface.
Solution Approach 2:
The patent replaces direct mechanical/electrical RF power delivery mechanisms with a capacitive coupling system. This substitution eliminates the need for sliding contacts or rotary joints for RF power transmission, significantly simplifying the electrical coupling while enabling rotation.
3Manufacturing precision
If substrate rotation is enabled during deposition, then deposition uniformity improves, but device complexity increases due to rotation mechanism
Solution Approach 1:
The shaft structure serves multiple functions simultaneously: it provides mechanical support for the electrostatic chuck, enables rotation through motor coupling, and extends through the chuck to transmit rotational motion. This multi-functionality reduces the need for separate components and simplifies the overall rotation assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rotatable electrostatic chuck ensures uniform deposition on substrates by capacitive RF power coupling, enabling effective substrate retention and heating during microelectronic device fabrication, overcoming the limitations of conventional chucks.
Implementation Method 1
An electrostatic chuck is often used to electrostatically retain a substrate on a substrate support during the deposition process
Implementation Method 2
a lamp housing disposed below the dielectric disk and having a plurality of lamps to heat the dielectric disk
Implementation Method 3
a metallic plate disposed below the lamp housing to absorb heat generated by the plurality of lamps
Implementation Method 4
a rotatable radio frequency (RF) coupling device extending through the lamp housing and the metallic plate and coupled to the dielectric disk to provide RF power to one or more RF bias electrodes
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
Embodiments of the present disclosure relate to a rotatable RF coupling device and an electrostatic chuck incorporating the same. In some embodiments, a rotatable RF coupling device includes a conductive plate; a rotatable split cylinder configured to be coupled to a dielectric disk of an electrostatic chuck to provide RF power to one or more RF bias electrodes disposed within the dielectric disk; a plurality of RF input taps coupled to the conductive plate to couple RF power to the conductive plate; a stationary ring coupled to the conductive plate and surrounding the rotatable split cylinder; and a grounded shield surrounding the conductive plate, the stationary ring, and the rotatable split cylinder.