Rotatable Evaporation Source for OLED Deposition
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Solution Overview
Problem
The manufacturing of OLED displays faces challenges such as labor-intensive encapsulation processes, substantial reconfiguration requirements for different screen sizes, low material utilization, and inefficiencies in masking and deposition techniques, particularly for large area substrates.
Innovation Solution
A system and method for depositing organic layers on substrates using a load lock chamber, transfer chamber, vacuum swing modules, and deposition apparatuses that allow for efficient material utilization and precise masking, featuring a translational movement and rotational evaporation source for high material efficiency and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If traditional masking and deposition techniques are used for large area substrates, then deposition can be performed, but material utilization is low and idle time increases
Solution Approach 1:
The evaporation source is made rotatable and translatable to dynamically adjust its position and orientation during deposition. This allows the source to move across the substrate surface, enabling continuous deposition without masking and maximizing material utilization by directing evaporated material precisely where needed on large area substrates.
Solution Approach 2:
The system introduces rotational and translational degrees of freedom to the evaporation source, moving from a static single-point deposition approach to a multi-dimensional scanning approach. This allows coverage of large area substrates in multiple dimensions, eliminating the need for masking and reducing material waste.
2Productivity
If substrates are handled in conventional orientations, then loading and unloading is straightforward, but deposition efficiency and material utilization are reduced
Solution Approach 1:
The substrate is rotated from horizontal to vertical orientation during the deposition process. This dynamic change in orientation allows the evaporation source to scan across the substrate surface more effectively, improving deposition efficiency and material utilization while maintaining ease of operation through automated rotation mechanisms.
Solution Approach 2:
The system changes the operational parameter of substrate orientation from horizontal to vertical. This parameter change optimizes the deposition geometry, allowing better control over material distribution and reducing idle time while the automated rotation ensures ease of operation.
3Manufacturing precision
If masking is used for patterned layer deposition, then patterning is achieved, but the process becomes labor intensive and requires substantial reconfiguration for different sizes
Solution Approach 1:
The masking step is completely removed from the deposition process. Instead of using physical masks to define patterns, the system uses direct digital control of the rotatable and translatable evaporation source to deposit material only in desired locations, eliminating masking-related complexity and labor while maintaining patterning precision.
Solution Approach 2:
The mechanical masking system is replaced with a digitally controlled positional system. The evaporation source's position and movement are controlled by digital commands, allowing precise patterning without physical masks. This substitution eliminates the complexity of mask handling, alignment, and reconfiguration for different substrate sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances material utilization, reduces idle time, and improves scalability for large area substrates by maintaining the mask and substrate stationary during deposition, allowing for continuous coating with high material efficiency and reduced downtime.
Implementation Method 1
a first vacuum swing module provided between the load lock chamber and the transfer chamber
Implementation Method 2
at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber
Implementation Method 3
at least one deposition apparatus for depositing material in a vacuum chamber
Implementation Method 4
a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere
Implementation Method 5
transport the carrier under vacuum conditions and/or under a controlled inert atmosphere
Data Source
AI summary
A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.