Rotatable Fluid Head for Semiconductor Workpiece Cleaning
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Solution Overview
Problem
The existing electrochemical plating (ECP) process in semiconductor manufacturing is hindered by the time-consuming washing and drying of ECP fluid, which increases downtime between processing steps, reducing the manufacturing efficiency and units per hour (UPH) in semiconductor fabrication plants.
Innovation Solution
A movable and rotatable fluid head is used to eject both liquid and gaseous fluids for rapid cleaning and drying of the workpiece, incorporating a static eliminator to prevent static discharge and contamination, thereby reducing the time between processing steps and enhancing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional washing and drying methods are used for ECP fluid removal, then the workpiece is properly cleaned and dried, but the processing time increases significantly
Solution Approach 1:
The patent combines the washing and drying operations into a single integrated chamber, allowing both functions to be performed simultaneously or in rapid sequence without transferring the workpiece between separate washing and drying equipment, thereby reducing downtime while maintaining cleaning quality
Solution Approach 2:
The system uses dynamic control of fluid ejection parameters (pressure, flow rate, timing) to optimize the washing and drying process, enabling rapid removal of ECP fluid followed by efficient drying within a compressed time frame while ensuring thorough cleaning
2Productivity
If rapid drying is implemented to reduce downtime, then processing speed increases, but static discharge defects may occur
Solution Approach 1:
The system applies anti-static measures during the drying process to prevent static discharge defects before they can occur, allowing rapid drying to be performed without the harmful effects of static accumulation that would otherwise limit drying speed
Solution Approach 2:
The patent introduces an intermediary mechanism (anti-static treatment) between the rapid drying process and the workpiece surface, which mediates the interaction to prevent static discharge while maintaining the high-speed drying capability needed for increased productivity
3Reliability
If multiple separate processing chambers are used for plating, washing, and drying, then each function is performed optimally, but device complexity and space requirements increase
Solution Approach 1:
The patent merges plating, washing, and drying functions into a single integrated chamber or closely coupled system, eliminating the need for multiple separate chambers while maintaining the quality of each individual process through careful design of fluid delivery and removal mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly decreases the time required for washing and drying, increasing UPH by minimizing downtime and preventing static discharge-related defects, thus improving the overall efficiency of semiconductor device manufacturing.
Implementation Method 1
A movable and rotatable fluid head is used to eject both liquid and gaseous fluids for rapid cleaning and drying of the workpiece
Implementation Method 2
incorporating a static eliminator to prevent static discharge and contamination
Data Source
AI summary
The present disclosure is directed to a fluid head that is configured to eject a first fluid (e.g., a liquid state fluid) and a second fluid (e.g., a gaseous state fluid). The fluid head is movable in a rotatable-fashion and a translatable-fashion such that the fluid head may be utilized to increase a speed and decrease a period of time for cleaning and drying a workpiece after an electro-chemical polishing (ECP) process or step. The fluid head may also be utilized to increase a speed and decrease a period of time for beveling an edge of a conductive layer on the workpiece. The present disclosure is also directed to methods for cleaning and drying the workpiece as well as beveling the conductive layer of the workpiece utilizing the fluid head.