Rotatable Gas Injector for Uniform Batch Substrate Processing
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Solution Overview
Problem
The existing batch-type substrate processing apparatus has limitations in controlling the in-plane distribution of film characteristics due to a fixed injector, resulting in inconsistent film formation across substrates.
Innovation Solution
A substrate processing method involving a rotatable injector with gas holes along its longitudinal direction, allowing the supply direction of processing gas to be changed by rotating the injector according to specific operations, thereby controlling the in-plane distribution of the process performed on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the injector is fixed to the processing container, then the structure is simple and easy to manufacture, but the in-plane distribution of film characteristics cannot be sufficiently controlled
Solution Approach 1:
The injector is made rotatable around the vertical axis, transforming it from a fixed structure to a dynamic one. This allows the gas ejection portions to change their orientation relative to the substrates, enabling control over the in-plane distribution of film characteristics by adjusting the injector's rotational position during different processing operations.
2Manufacturing precision
If the discharge direction of gas is constant, then the injector structure is simple, but the in-plane distribution of process characteristics cannot be controlled
Solution Approach 1:
The injector's ability to rotate around the vertical axis provides dynamic control over gas discharge direction. By changing the rotational position of the injector, the discharge direction of gas from multiple ejection portions can be adjusted, enabling precise control of in-plane distribution of process characteristics on substrates.
3Reliability
If the injector is fixed, then the device is easier to operate, but film formation consistency across substrates deteriorates
Solution Approach 1:
The rotatable injector allows the system to adapt gas distribution patterns to match different substrate positions and processing requirements. By rotating the injector to appropriate angles, consistent film formation can be achieved across multiple substrates held in the substrate holder, improving reliability of film formation consistency.
Solution Approach 2:
Different gas ejection portions on the injector can be oriented to target specific regions of substrates. By rotating the injector, different local regions receive optimized gas supply, ensuring uniform and consistent film formation across the entire substrate surface and across multiple substrates in the batch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively controls the in-plane distribution of film characteristics, ensuring consistent and uniform processing across substrates by dynamically adjusting the gas supply direction during processing operations.
Implementation Method 1
supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector
Data Source
AI summary
A substrate processing method includes supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector, which extends in a vertical direction along an inner wall surface of a processing container and is rotatable around a rotational axis extending in the vertical direction, to perform a predetermined process on a substrate accommodated in the processing container. The predetermined process includes a plurality of operations, and a supply direction of the processing gas is changed by rotating the injector in accordance with the operations.