Rotatable Heat Dissipation Assembly for Uniform Thermal Management
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Solution Overview
Problem
Existing electronic products face uneven heat distribution and high central temperatures due to concentrated heat generation, which affects normal operation and requires efficient heat dissipation methods.
Innovation Solution
An electronic device with a heat dissipation assembly that includes rotatable heat dissipation components and a temperature monitoring system, where a magnetic component is controlled based on temperature readings to adjust the position of heat-conducting boards for uniform heat dissipation through strategically placed holes on the top cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat dissipation holes are located on the top region of the case to meet overall heat dissipation requirement, then overall heat dissipation is improved, but temperature distribution becomes uneven with center temperature significantly higher than sides
Solution Approach 1:
The patent applies local quality by placing heat dissipation holes at different densities in different regions of the case. Specifically, more heat dissipation holes are arranged in the center region where the main chip is located and heat concentration is highest, while fewer holes are placed at the sides. This non-uniform distribution optimizes heat dissipation at each local region according to its heat generation characteristics, resolving the contradiction between overall heat dissipation efficiency and temperature distribution uniformity.
2Productivity
If main chip is located at center of electronic product, then functional integration is improved, but heat concentration at center causes uneven temperature distribution
Solution Approach 1:
The patent addresses the heat concentration problem caused by central chip placement by implementing local quality through region-specific heat dissipation hole distribution. The center region, which experiences highest heat concentration due to the main chip, is equipped with a higher density of heat dissipation holes. This localized optimization allows the system to maintain central chip placement for functional integration while effectively managing the resulting heat concentration through enhanced local heat dissipation capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform heat dissipation, preventing excessive local temperatures and improving operational efficiency by automating temperature monitoring and heat management, thus enhancing the overall heat dissipation performance.
Implementation Method 1
a temperature sensor monitors the heating element and controls the magnetic components to adjust the position of heat-conducting boards
Implementation Method 2
adjust the position of heat-conducting boards for uniform heat dissipation
Data Source
AI summary
An electronic device able to regulate its own working temperature and keep the same constant notwithstanding light or heavy processor activity includes a shell, a circuit board mounted on the shell, a control module and a heating element mounted on the circuit board, and a heat dissipation assembly. The connecting assembly includes a first heat dissipation component, a second heat dissipation component, and a connecting assembly. The first heat dissipation component includes a first heat-conducting board. an elastic component, and a second magnetic component. The second heat dissipation component includes a second support with a second heat-conducting board rotatably mounted. The connecting assembly rotatably connects the first support and the second support and brings the heat dissipation components together for high-temperature heat dissipation and separates same when low working heat is generated. The electronic device dissipates heat evenly through the heat dissipation assembly.