Rotatable Heat-Dissipation Structure for Fan Failure Adaptation

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Solution Overview

Problem

Conventional heat-dissipation systems in computers are inefficient when fans stop working, leading to reduced airflow and increased temperatures, which can cause overheating and decrease processing efficiency.

Innovation Solution

An electronic apparatus with a heat-dissipation system that includes a rotatable heat-dissipation structure and a driving mechanism, allowing the structure to adjust its orientation based on fan operation conditions or heat source temperatures to optimize airflow and prevent overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional heat-dissipation structures are used with multiple fans, then heat dissipation is adequate under normal conditions, but heat-dissipation efficiency decreases when fans stop working

Engineering Contradiction:
Improveheat-dissipation efficiencyVSAvoidadaptability to fan failure conditions
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The heat-dissipation structure is designed to be rotatable, allowing it to dynamically change its orientation and airflow passage configuration in response to different operating conditions, including fan failures. This enables the system to adapt its heat dissipation pattern rather than remaining static, resolving the contradiction between reliable heat dissipation and adaptability to fan failure.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the physical parameter of airflow passage orientation by rotating the heat-dissipation structure to different positions. This parameter change allows the system to optimize airflow paths based on which fans are operational, maintaining heat-dissipation efficiency across varying conditions.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If airflow amount is increased to improve heat dissipation, then heat-dissipation efficiency improves, but system complexity increases

Engineering Contradiction:
Improveheat-dissipation efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Rather than using multiple complex control mechanisms for each fan, the invention employs a single rotatable heat-dissipation structure that can be positioned to optimize airflow. This dynamic reconfiguration approach improves heat dissipation without proportionally increasing system complexity.

Inventive Principle:
Principle #15Dynamics

3Productivity

If processing chips operate at full speed, then computing efficiency improves, but heat generation increases leading to overheating

Engineering Contradiction:
Improvecomputing efficiencyVSAvoidchip temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The rotatable heat-dissipation structure is prepared in advance with multiple positional configurations that correspond to different thermal loads and fan operational states. When processing chips operate at full speed, the system can immediately switch to the appropriate configuration rather than reacting to overheating, preventing temperature issues before they occur.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system incorporates sensors that detect temperature and fan operational status, providing feedback to the control device. This feedback mechanism allows the system to monitor chip temperature and airflow conditions, automatically adjusting the heat-dissipation structure's position to maintain optimal thermal conditions during high-speed operation.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system improves heat-dissipation efficiency by adjusting the orientation of heat-dissipation structures, maintaining optimal airflow even when fans are not working, thus preventing overheating and maintaining processing efficiency.

Implementation Method 1

a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

The heat-dissipation structure is rotated to one of the predetermined orientations by changing the intensity of the first magnetic field

Methodology Applied
Scientific EffectElectromagnetic force: Electromagnet

Data Source

PatentUS20190171260A1Electronic apparatus with heat-dissipation system and heat-dissipation device thereof
Publication Date: 2019.06.06 WISTRON CORP
  • US20190171260A1 patent drawing
  • US20190171260A1 patent drawing
  • US20190171260A1 patent drawing

AI summary

An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations.