Rotatable Adsorption Heating Plate for Semiconductor Wafer Processing
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Solution Overview
Problem
Current semiconductor equipment struggles to simultaneously perform vacuum adsorbing, rotating, and heating functions on wafers due to limitations in heating affecting rotation, leading to potential defects in the processing of complex semiconductor processes.
Innovation Solution
An adsorbing apparatus that integrates rotating and heating functions, featuring a hotplate with vacuum channels and adjustable heating, a conductive rotating ring for cable management, and a pin-driven mechanism for precise wafer handling, allowing for simultaneous and controlled wafer rotation and heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating function is added to the adsorbing apparatus, then wafer temperature control is improved, but the rotating function is affected due to heating limitations
Solution Approach 1:
The apparatus is divided into functionally independent modules: a heating module with heating wires embedded in the adsorbing hotplate, a vacuum adsorbing system with separate vacuum channels, and a rotating drive system with motor and transmission mechanism. This segmentation allows each module to operate independently without mutual interference, enabling simultaneous heating, adsorbing, and rotating functions.
Solution Approach 2:
The apparatus employs adjustable heating control to dynamically regulate temperature according to process requirements, and the rotating shaft enables dynamic rotation at variable speeds. The pin driving device also provides dynamic control for wafer loading and unloading operations, allowing the system to adapt to different process stages.
2Adaptability or versatility
If vacuum adsorbing function is combined with heating and rotating, then the apparatus becomes more versatile, but the system complexity increases making simultaneous operation difficult
Solution Approach 1:
The adsorbing hotplate serves multiple functions: it provides vacuum adsorption through embedded vacuum channels, heating through embedded heating wires, and mechanical support for the wafer. The rotating shaft simultaneously supports vacuum supply, electrical power transmission through conductive rings, and mechanical rotation. This multi-functionality reduces the need for separate components while maintaining operational independence.
Solution Approach 2:
The conductive rotating ring acts as an intermediary component that transmits electrical power and signals between the stationary base and the rotating shaft, enabling the rotating function while maintaining electrical connectivity. The vacuum sealing equipment serves as an intermediary to maintain vacuum isolation between the rotating and stationary parts, allowing rotation without compromising vacuum integrity.
3Manufacturing precision
If pin-driven wafer loading mechanism is used, then wafer positioning precision is improved, but the device complexity increases
Solution Approach 1:
The pin driving device automatically performs wafer loading and unloading operations through its up-and-down movement, eliminating the need for manual intervention. The transmission mechanism automatically transmits rotational motion from the motor to the rotating shaft, and the vacuum system automatically adsorbs and releases the wafer based on vacuum pressure control, reducing operational complexity despite the mechanical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature control and optional rotating functions, ensuring defect-free wafer processing by addressing the limitations of existing technologies and providing a rational, stable, and multi-functional solution for various semiconductor processes.
Implementation Method 1
The heating module that is installed inside the adsorbing hotplate can control the adsorbing hotplate to the specified degree. Thus the heating wafer can be achieved in specified degree.
Implementation Method 2
The adsorbing hotplate adsorb wafer is by means of vacuum.
Data Source
AI summary
An adsorption device for rotatable heating is provided with an adsorption heating plate, a support needle driving device, a rotary sliding ring, and a turning shaft. The adsorption heating plate is amounted at the top of the turning shaft, and a wafer is arranged at the top of the adsorption heating plate. The rotary sliding ring is connected to the turning shaft in which a vacuum channel and a connection wire channel are arranged. Support needles are connected to the output end of the support needle driving device, run through the adsorption heating plate, and are arranged at the bottom of the wafer uniformly. The adsorption device incorporates the wafer adsorption function, the wafer rotating function with controllable speed, and the heating function for heating the wafer to reach different temperatures, thereby providing adsorption and heating rotation at the same time.