Rotatable Laptop Cooling Assembly with Heat Pipes
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Solution Overview
Problem
Current cooling systems for mobile computers, particularly gaming laptops, face challenges in efficiently dissipating internal heat without compromising portability or ergonomic design, often resulting in thicker, heavier devices with limited effectiveness in addressing internal operating temperatures.
Innovation Solution
An integral cooling system that includes a rotatable cooling assembly with a cold plate, heat pipes, and a ventilator assembly, which directs airflow through a remote heat sink to dissipate heat externally, while also allowing the keyboard to be angled for improved typing ergonomics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If larger internal airflow and venting requirements are implemented for gaming laptop cooling, then heat dissipation effectiveness is improved, but device thickness and weight increase
Solution Approach 1:
The cooling assembly is nested within the laptop device housing, with the ventilator assembly positioned at the rear and the heat sink structure integrated into the existing chassis. This nesting approach allows the cooling system to be contained within the device boundaries without significantly increasing external dimensions or weight.
Solution Approach 2:
The cooling system utilizes the vertical dimension by positioning the keyboard at the front edge of the PC case and creating airflow paths that move heat from internal components through the heat sink to external venting at the rear. This three-dimensional heat transfer path allows effective cooling without proportionally increasing device volume.
2Temperature
If keyboard is positioned at front edge for thermal assembly considerations, then heat dissipation is improved, but typing ergonomics deteriorate
Solution Approach 1:
The cooling assembly is designed to be rotatable relative to the laptop housing, allowing the keyboard and display to be inclined at various angles. This dynamic adjustment capability enables users to optimize both typing ergonomics and heat dissipation effectiveness by selecting appropriate operating angles.
Solution Approach 2:
The cooling assembly serves multiple functions: it acts as both a thermal management system with heat sink and ventilator, and simultaneously provides keyboard support and display positioning capabilities. This multi-functionality resolves the contradiction by integrating ergonomic adjustment into the cooling structure itself.
3Temperature
If external stands with internal fans are used for cooling, then external cooling capability is improved, but internal operating temperatures remain unaffected
Solution Approach 1:
The harmful heat generated by internal electronic components is extracted from the device interior through thermal conduction to the heat sink structure. The ventilator assembly then expels this extracted heat to the external environment, separating the internal heat generation from the external dissipation process.
Solution Approach 2:
The heat sink structure acts as an intermediary between internal heat-generating components and the external environment. It conducts heat from internal components and transfers it to external air flow generated by the ventilator, effectively mediating the heat transfer process and cooling internal operations.
4Temperature
If additional openings or vents are provided in PC chassis, then heat venting capacity is improved, but device complexity increases without direct heat sinking
Solution Approach 1:
The cooling assembly merges multiple functions into a single integrated structure: the heat sink provides both structural support and thermal dissipation, while the ventilator assembly combines airflow generation with keyboard support and display positioning. This merging reduces overall device complexity compared to separate components.
Solution Approach 2:
The cooling assembly is designed as a multi-functional component that simultaneously provides heat sinking, forced airflow, keyboard support, and display positioning. This universality eliminates the need for separate chassis modifications and reduces overall design complexity while maintaining improved heat venting capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively transfers internal heat to the external environment, enhancing cooling efficiency and user experience by maintaining a suitable operating temperature without increasing the device's bulk or weight, thus addressing the limitations of existing cooling solutions.
Implementation Method 1
a cold plate adapted to be thermally coupled to and conduct heat from one or more electronic components
Implementation Method 2
a heat pipe having a proximal portion in thermal contact with the cold plate and adapted to convey the conducted heat from the cold plate
Implementation Method 3
a ventilator assembly rotatably coupled to a distal portion of the heat pipe and adapted to dissipate the heat conveyed by the heat pipe to an external environment
Implementation Method 4
a heat sink member disposed proximate the distal portion of the heat pipe and adapted to dissipate the heat conveyed by the heat pipe
Data Source
AI summary
System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.