Multi-Station Substrate Tool with Rotatable Lower Portion

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Solution Overview

Problem

Existing substrate processing tools face challenges in achieving high throughput and reducing material costs while allowing for efficient pre- and post-processing options, often resulting in a large footprint due to replicated subsystems and lack of integrated multi-station sequential processing capabilities.

Innovation Solution

A substrate processing tool design featuring multiple processing stations arranged in two transfer planes with a central cavity, where a robot facilitates transfer between stations, enabling multi-station sequential processing, pre- and post-processing, and utilizing a rotatable lower tool portion with gas bearing surfaces and differential pumping for efficient substrate handling and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple sequential processing stations are arranged in a single plane around a centralized wafer handler, then substrate throughput is improved and handling is reduced, but the overall footprint becomes relatively large

Engineering Contradiction:

Improvesubstrate throughputVSAvoidtool footprint

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent transitions from a single-plane arrangement to a two-plane configuration, with processing stations distributed across upper and lower levels around the central cavity. This vertical dimensionality change allows the same number of stations to occupy a smaller horizontal footprint while maintaining throughput capability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The rotatable lower tool portion is nested within the upper tool portion, creating a compact two-level structure. The lower portion rotates on bearing surfaces that are integrated into the upper portion, effectively nesting one functional subsystem within another to reduce overall footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If pre-processing and post-processing modules are added to multi-station sequential processing tools, then processing versatility is improved, but material cost increases due to replication of subsystems

Engineering Contradiction:

Improveprocessing capabilityVSAvoidmaterial cost

Core Design Contradiction:

Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

The patent designs the processing stations and wafer handler to serve multiple functions. The same rotational mechanism, bearing surfaces, and station interfaces are used for both sequential multi-station processing and for accommodating pre-/post-processing modules, eliminating the need to replicate subsystems for different processing modes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The rotatable lower tool portion provides dynamic reconfigurability, allowing the system to switch between different processing configurations. The rotation mechanism enables flexible positioning of stations and modules, allowing a single set of components to perform multiple processing functions rather than requiring static, dedicated subsystems for each function.

Inventive Principle:

Principle #15Dynamics

3Productivity

If a rotatable lower tool portion is implemented with bearing surfaces, then substrate transfer efficiency is improved, but device complexity increases

Engineering Contradiction:

Improvesubstrate transfer efficiencyVSAvoidmechanical complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent employs gas bearing surfaces for the rotation mechanism, replacing traditional mechanical bearings with a pneumatic field-based support system. This eliminates physical contact and mechanical friction, reducing wear and maintenance complexity while enabling smooth, precise rotation for efficient substrate transfer.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances throughput, reduces material costs, and optimizes footprint utilization by allowing efficient substrate processing with minimal contamination, supporting processes like ALD, PEALD, CVD, and PECVD, while enabling pre- and post-processing operations on a single tool.

Implementation Method 1

A rotatable lower tool portion rotates relative to the upper tool portion

Methodology Applied

Scientific EffectGas bearing: Air Lubrication

Implementation Method 2

differential pumping for efficient substrate handling and processing

Methodology Applied

Scientific EffectDifferential pumping: Pressure Gradient

Data Source

PatentUS9916995B2Compact substrate processing tool with multi-station processing and pre-processing and/or post-processing stations

Publication Date: 2018.03.13 LAM RES CORP

AI summary

A substrate processing tool includes N substrate processing stations arranged in a first transfer plane around a central cavity, where N is an integer greater than one. At least one of the N substrate processing stations is configured to process the substrate. M substrate processing stations are arranged in a second transfer plane around the central cavity, where M is an integer greater than one. The second transfer plane is arranged parallel to and above the first transfer plane. An upper tool portion includes the M substrate processing stations and a first portion of the N substrate processing stations. A rotatable lower tool portion rotates relative to the upper tool portion. A second portion of the N substrate processing stations rotates with the rotatable lower tool portion.