Rotatable Magnetron Assembly for Dual DC RF Sputtering
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Solution Overview
Problem
Current magnetrons cannot simultaneously provide effective DC and RF plasma confinement in the same chamber, leading to suboptimal sputtering rates and uniformity due to the need for closed loop and open loop magnetic fields, which are typically exclusive to either DC or RF sputtering.
Innovation Solution
A magnetron assembly with rotatable plates having open loop magnetic poles that can align to form closed loop magnetic poles, allowing for controlled magnetic field configuration to support both DC and RF sputtering operations by rotating the plates to align open loop magnetic poles, enabling flexible plasma confinement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a closed loop magnetic field is used for DC sputtering, then electron confinement is improved, but the magnetron cannot be used for RF sputtering
Solution Approach 1:
The magnetron employs rotatable plates with magnetic poles that can dynamically change their angular position. By rotating the plates, the magnetic field configuration transitions between closed loop (for DC sputtering) and open loop (for RF sputtering), making the device adaptable to different sputtering modes without requiring separate magnetron designs
Solution Approach 2:
The magnetron is designed to perform multiple functions by using the same hardware components (rotatable plates with magnetic poles) to generate different magnetic field configurations. The plates can be positioned to create either closed loop or open loop fields, allowing a single magnetron to serve both DC and RF sputtering applications
2Productivity
If an open loop magnetic field is used for RF sputtering, then plasma flexibility is improved, but sputtering rate decreases due to plasma over-concentration
Solution Approach 1:
The rotatable plates enable dynamic adjustment of the magnetic field configuration. During RF sputtering, the plates can be rotated to create an open loop field for plasma flexibility, or adjusted to partial closed loop configurations to control plasma concentration and maintain higher sputtering rates by preventing excessive plasma buildup in the race track area
3Reliability
If separate magnetrons are used for DC and RF sputtering, then plasma confinement is optimized for each mode, but device complexity and cost increase
Solution Approach 1:
The magnetron uses the same rotatable plates and magnetic pole structures for both DC and RF sputtering modes. By rotating the plates to different angular positions, the system achieves optimized plasma confinement for each mode without requiring separate magnetron assemblies, thereby reducing device complexity and cost while maintaining reliable performance
Solution Approach 2:
The dynamic rotation capability of the plates allows the magnetic field configuration to be adjusted between closed loop and open loop modes, enabling a single magnetron assembly to provide optimized plasma confinement for both DC and RF sputtering operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a more uniform erosion pattern and deposition profile by adjusting the magnetic field phase, enhancing sputtering rates and control in physical vapor deposition processes, accommodating both DC and RF sputtering requirements within the same chamber.
Implementation Method 1
a magnetron positioned at the back of the sputtering target to project a magnetic field into the processing space to increase the density of the plasma and enhance the sputtering rate
Implementation Method 2
Plasma sputtering may be accomplished using either DC sputtering or RF sputtering
Implementation Method 3
sputtering metal atoms from the target using the plasma while maintaining a first pressure in the PVD chamber sufficient to ionize a predominant portion of the metal atoms sputtered from the target
Data Source
AI summary
Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first plate having a first central axis, the first plate rotatable about the first central axis, a first open loop magnetic pole coupled to the first plate, a second plate having a second central axis, the second plate rotatable about the second central axis, and a second open loop magnetic pole coupled to the second plate, wherein the first open loop magnetic pole and the second open loop magnetic pole form a closed loop magnetic pole when the first and second open loop magnetic poles are aligned.