Rotatable Magnetron for PVD Resputter Uniformity
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Solution Overview
Problem
Conventional physical vapor deposition (PVD) processes, such as for tantalum deposition, often result in non-uniform etch and resputter ratios due to plasma confinement near the target, leading to inconsistent film deposition.
Innovation Solution
A magnetic field is formed within a process chamber using a support member with first and second bodies, each equipped with magnets arranged in a specific configuration to produce uniform magnetic fields, enhancing resputter and etch rate uniformity by steering ions and electrons effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single deposition magnet is used, then the plasma is confined near the target, but the etch and resputter ratios become non-uniform
Solution Approach 1:
The single deposition magnet is divided into two separate magnetrons, each independently positioned and controlled. This segmentation allows the plasma to be generated and confined more effectively near the target while distributing the magnetic field coverage to achieve uniform etch and resputter ratios across the substrate surface.
Solution Approach 2:
The patent introduces rotational movement of the magnetrons around the target, adding a temporal and spatial dimension to the magnetic field application. By rotating the magnetrons, the plasma confinement and magnetic field distribution are dynamically adjusted across different angular positions, achieving uniformity that cannot be obtained with static single magnet configuration.
2Device complexity
If a single deposition magnet is used, then the device complexity is reduced, but the deposition uniformity deteriorates
Solution Approach 1:
The magnetrons are configured to rotate around the target during deposition, transforming a static single-magnet system into a dynamic multi-position system. This rotational movement allows the magnetic field to sweep across different areas of the target, achieving uniform film deposition without requiring a complex array of fixed magnets covering the entire target surface.
Solution Approach 2:
The patent combines the functions of multiple magnets into a rotating dual-magnetron system, where both magnetrons work cooperatively to generate and confine plasma across the target surface. This merging approach achieves the uniformity benefits of multiple stationary magnets while maintaining a simpler, more compact device structure with fewer total magnetic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved resputter and etch rate uniformity, resulting in a uniform thickness profile of deposited layers, addressing the non-uniformity issues in conventional PVD processes.
Implementation Method 1
a rotatable magnetron disposed within the target assembly and proximate the back surface of the target, the rotatable magnetron comprising a support member having a first side and a second side coupling a first end to a second end and an axis of rotation between the first end and the second end; a first body coupled to the first end of the support member and extending away from the first side of the support member, wherein the first body has a plurality of first magnets coupled to a bottom of the first body
Data Source
AI summary
A magnetic field forming apparatus includes a support member having a first side and a second side coupling a first end to a second end and an axis of rotation between the first end and the second end; a first body coupled to the first end of the support member and extending away from the first side of the support member, wherein the first body has a plurality of first magnets coupled to a bottom of the first body; a second body rotatably coupled to the second end of the support member and extending away from the second side of the support member, wherein the second body has a plurality of second magnets coupled to a bottom of the second body, wherein the plurality of the first magnets are disposed about 180 degrees from the plurality of second magnets with respect to the axis of rotation of the support member.