Rotatable Nozzle Fluid Impingement Cooling for IC Hotspots
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Solution Overview
Problem
Conventional liquid cooling apparatuses for electronic components are ineffective in addressing non-uniform heat distribution, leading to performance degradation and potential failure due to localized high heat flux zones, or hotspots, which are not adequately cooled by uniform fluid impingement methods.
Innovation Solution
A fluid impingement cooling apparatus with rotatable nozzles that can be individually oriented to target specific hotspots on a heat-generating electronic component, using a microcontroller to identify temperature thresholds and adjust nozzle orientation to efficiently direct fluid for localized cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If uniform fluid impingement cooling is used, then the cooling coverage area is maximized, but the localized hotspot cooling effectiveness deteriorates
Solution Approach 1:
The nozzle is made rotatable to dynamically change its orientation and redirect the fluid jet toward hotspots. The nozzle can rotate between a first orientation for general area cooling and a second orientation for targeted hotspot cooling, allowing the system to adapt to varying thermal conditions on the electronic component surface.
Solution Approach 2:
The cooling system transitions from uniform fluid distribution to localized fluid impingement at hotspots. By rotating the nozzle to specific orientations, the fluid jet is concentrated on high-temperature regions rather than being uniformly distributed, providing enhanced cooling where it is most needed.
2Area of stationary object
If multiple fixed nozzles are used to cover different areas, then the cooling coverage is improved, but the device complexity increases
Solution Approach 1:
A single nozzle is designed to perform multiple functions by rotating to different orientations. The same nozzle can cool different areas of the electronic component surface at different times, replacing the need for multiple fixed nozzles and simplifying the overall system structure while maintaining comprehensive cooling coverage.
Solution Approach 2:
The nozzle system uses rotational movement to provide dynamic cooling coverage across different areas. Instead of requiring multiple static nozzles positioned at fixed locations, one rotatable nozzle can sequentially target various regions, reducing component count and system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools hotspots on electronic components by dynamically adjusting nozzle orientation based on temperature data, improving thermal management and extending the lifespan and performance of electronic devices by ensuring uniform heat dissipation.
Implementation Method 1
Fluid impingement cooling apparatuses, commonly referred to as jet impingement apparatuses, and other direct liquid contact thermal solutions, are commonly used for dissipating heat and reducing the operational temperature of electronic components
Data Source
AI summary
Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.