Rotatable Oblong Cooling Tube for Memory Module Thermal Management
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Solution Overview
Problem
Existing memory module coolers often fail to effectively manage heat dissipation across various memory module form factors, requiring multiple designs for different thicknesses and necessitating the use of thermal interface materials, which complicates installation, servicing, and replacement.
Innovation Solution
A liquid cooling system with rotatable oblong cooling tubes connected to manifolds, allowing for adjustable horizontal offset and deformation to ensure good thermal contact with memory modules of varying thicknesses without the need for thermal interface materials, enabling flexible compatibility and easy access for maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional fixed-design coolers are used for different memory module thicknesses, then multiple cooler designs are required, but device complexity and installation complexity increase
Solution Approach 1:
The cooling tube is designed with rotational capability, allowing it to dynamically adjust its orientation angle relative to the memory module. This dynamic adjustment enables a single cooler design to adapt to different memory module thicknesses by rotating the cooling tube to the appropriate angle, eliminating the need for multiple fixed-design coolers.
Solution Approach 2:
The patent changes the orientation parameter of the cooling tube by allowing rotation around an axis parallel to the memory module's length. This parameter change (rotation angle) enables the same cooling tube to make contact with memory modules of varying thicknesses, providing versatility without increasing device complexity.
2Reliability
If thermal interface materials are used to ensure thermal contact, then thermal contact is improved, but installation complexity and potential for user errors increase
Solution Approach 1:
The rotatable cooling tube design enables the cooling system to self-adjust to different memory module thicknesses through rotation, achieving reliable thermal contact without requiring thermal interface materials. This eliminates the need for users to apply or manage thermal paste, reducing installation complexity and potential for user errors.
Solution Approach 2:
The patent extracts the thermal interface material from the cooling system by designing a mechanical solution (rotatable cooling tube) that achieves thermal contact through rotation and deformation alone, eliminating the need for separate thermal interface materials and simplifying the overall installation process.
3Ease of repair
If memory modules need to be accessed for servicing or replacement, then maintenance is possible, but the cooler must be uninstalled first, causing loss of time and productivity
Solution Approach 1:
The cooling tube is segmented from the fixed cooler structure and given rotational independence, allowing it to be adjusted to different positions. This segmentation enables the cooling tube to be rotated out of the way during memory module access while the rest of the cooler remains installed, eliminating the need to uninstall the entire cooler for maintenance.
Solution Approach 2:
The rotatable cooling tube provides dynamic positioning capability, allowing it to be rotated to accommodate memory module removal and reinstallation. This dynamic adjustment enables quick access to memory modules without time-consuming cooler uninstallation, improving productivity during maintenance operations.
4Stability of the object's composition
If cooling tubes are made rigid for structural stability, then structural stability is improved, but adaptability to different memory module thicknesses deteriorates
Solution Approach 1:
The cooling tube is constructed from a composite material combining rigidity for structural stability with flexibility for deformation capability. This composite structure allows the tube to maintain its shape and strength while being capable of deforming to conform to different memory module thicknesses when rotated into position.
Solution Approach 2:
The cooling tube incorporates flexible characteristics that allow it to deform and conform to different memory module thicknesses while maintaining structural integrity. This flexibility enables the tube to adapt to various form factors while retaining sufficient rigidity to effectively conduct heat away from the memory modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat conduction across multiple memory module form factors, reduces installation complexity, and allows for easy access and replacement without uninstalling the cooler, enhancing cooling efficiency and reducing the risk of user errors or damage.
Implementation Method 1
The cooling tubes may be thermally conductive and configured to contact their respective adjacent memory modules when the memory module cooler is in the second configuration
Data Source
AI summary
An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.