Rotatable Particle Source for Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face limitations in adjusting the distance and posture between a particle source and a substrate, particularly when processing substrates with complex shapes like concave surfaces, which restricts the adjustable range and can lead to increased apparatus size.
Innovation Solution
A substrate processing apparatus equipped with a conveyance mechanism, a particle source, a rotation mechanism to pivot the particle source, and a movement mechanism to adjust the distance between the particle source and the substrate, allowing for precise control of the relative posture and position during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the adjustment range of substrate posture and position is increased to process complex-shaped substrates, then the adjustable range between particle source and substrate is improved, but the apparatus size increases
Solution Approach 1:
The cathode unit is made rotatable about a rotation axis, allowing dynamic adjustment of the particle source position and posture. This rotational capability enables the system to adapt to different substrate shapes and processing requirements without requiring a larger fixed adjustment range, thus improving versatility while maintaining compact apparatus dimensions.
2Adaptability or versatility
If the pivot range of the cathode unit is increased to enhance processing flexibility, then the adjustable range is improved, but the apparatus size increases
Solution Approach 1:
The cathode unit's rotatability provides dynamic pivot capability within a reasonable angular range, enabling flexible positioning for various substrate configurations. This rotational mechanism achieves the required adaptability without necessitating an excessively large pivot range that would expand the overall apparatus volume.
3Manufacturing precision
If the distance between particle source and substrate is adjusted for complex surfaces, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The rotatable cathode unit enables dynamic adjustment of the particle source-to-substrate distance through rotational movement. This single rotational degree of freedom provides effective distance control for various substrate geometries and ensures high-quality film formation without requiring multiple independent adjustment mechanisms, thus avoiding excessive device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the adjustable range between the particle source and substrate, enabling efficient film formation on complex surfaces while maintaining a compact apparatus size, thereby improving processing flexibility and efficiency.
Implementation Method 1
The particle source can be, for example, a target held by a cathode, or an ion beam source. When the particle source is a target, the substrate processing apparatus can be used as a sputtering apparatus (deposition apparatus).
Data Source
AI summary
A substrate processing apparatus that processes a substrate using particles, includes a conveyance mechanism configured to convey the substrate along a conveyance surface, a particle source configured to emit particles, a rotation mechanism configured to make the particle source pivot about a rotation axis, and a movement mechanism configured to move the particle source such that a distance between the particle source and the conveyance surface is changed.