Rotatable Target Devices for Uniform Sputtering Deposition

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Solution Overview

Problem

Existing sputtering apparatuses face challenges in processing large-area substrates, resulting in increased size, cost, and uneven surface deposition due to the need for numerous target devices and fixed positions, leading to poor operational and image-quality characteristics.

Innovation Solution

A sputtering apparatus with rotatable and shiftable target devices, arranged parallel to each other, which rotate in specific directions to ensure uniform deposition across the substrate, reducing the number of target devices and apparatus size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the number of target devices is increased to process large-area substrates, then the deposition uniformity is improved, but the apparatus size and cost increase

Engineering Contradiction:
Improvedeposition uniformityVSAvoidapparatus size
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The target devices are made rotatable around axes perpendicular to the substrate, allowing dynamic adjustment of target orientation. This enables a smaller number of targets to cover larger substrate areas by changing their emission directions, resolving the contradiction between deposition uniformity and apparatus size

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention introduces rotational movement in a new dimension (around vertical axes) rather than only linear arrangement. This allows target particles to reach different substrate regions through rotation, achieving better deposition uniformity without proportionally increasing the number of targets or apparatus footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the gap between adjacent target devices is reduced, then the deposition uniformity is improved, but the apparatus size and target device count increase

Engineering Contradiction:
Improvedeposition uniformityVSAvoidnumber of target devices
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

By making targets rotatable, the invention reduces the need for closely spaced fixed targets. The rotational movement allows each target to cover a broader area, enabling larger gaps between targets while maintaining deposition uniformity, thus reducing the number of target devices required

Inventive Principle:
Principle #15Dynamics

3Device complexity

If target devices are fixed in position, then the structure is simple, but the deposition uniformity deteriorates

Engineering Contradiction:
Improvetarget device structureVSAvoiddeposition uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The invention introduces minimal complexity by adding rotational capability to target devices. This dynamic feature allows targets to adjust their orientation and cover different substrate areas, significantly improving deposition uniformity while adding only moderate structural complexity compared to completely fixed targets

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves a more compact and cost-effective sputtering apparatus capable of forming a uniformly deposited layer on large-area substrates, enhancing operational and image-quality characteristics by minimizing the number of target devices and optimizing target particle distribution.

Implementation Method 1

When a predetermined positive voltage is supplied to the susceptor 2 and a predetermined negative voltage is supplied to the target 5, Ar gas is ionized to Ar+ ions to generate plasma. Because more electrons are collected by the magnetic field of the magnet 7, the generated plasma becomes high-density plasma.

Methodology Applied
Scientific EffectPlasma discharge: Plasma

Implementation Method 2

A predetermined potential difference occurs between the region of the high-density plasma and the target 5. The Ar+ ions contained in the high-density plasma region are accelerated by the energy of the predetermined potential difference and thus collide against the target 5. These collisions cause the target 5 to emit target particles

Methodology Applied
Scientific EffectIon acceleration: Ion Beam

Implementation Method 3

The target 5 emits target particles and is fixed on the front surface of the baking plate 6 that faces the susceptor 2. The emitted target particles are deposited on the substrate 1.

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS7981263B2Sputtering apparatus, method of driving the same, and method of manufacturing substrate using the same
Publication Date: 2011.07.19 AVACO
  • US7981263B2 patent drawing
  • US7981263B2 patent drawing
  • US7981263B2 patent drawing

AI summary

A sputtering apparatus includes a susceptor having a substrate and a plurality of target devices facing the substrate and substantially parallel to each other, each target device being rotatable.