Rotatable Transfer Assemblies for Semiconductor Device Alignment
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Solution Overview
Problem
The existing semiconductor device transfer systems are slowed down by optical inspection processes, which are typically performed on the device transfer path, leading to reduced machine output and throughput due to the placement of the chip flip unit between the chip transfer unit and the carrier substrate.
Innovation Solution
The system employs rotatable transfer assemblies with centers positioned in parallel to the carrier structure's bond surface, allowing for parallel inspection and transfer operations, thereby separating inspection positions from the device transfer path and enabling faster semiconductor device alignment and placement without slowing down the machine cycle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical inspection processes are performed on the device transfer path using a chip flip unit between the chip transfer unit and carrier substrate, then alignment and quality verification of semiconductor devices can be achieved, but machine output and throughput are reduced due to sequential operation requirements
Solution Approach 1:
The patent repositions the optical inspection system from the linear device transfer path to a separate spatial dimension. The inspection system is configured to inspect semiconductor devices during their transfer between wafer and carrier without requiring the devices to pass through a traditional chip flip unit, thereby enabling parallel inspection operations that do not block the main transfer path and maintain high throughput while ensuring alignment precision.
Solution Approach 2:
The patent separates the inspection function from the transfer path by implementing an independent optical inspection system with separate inspection positions. This segmentation allows inspection operations to occur in parallel with transfer operations, eliminating the sequential bottleneck caused by traditional in-line inspection methods and enabling continuous high-speed device transfer while maintaining quality verification.
2Ease of operation
If a chip flip unit is placed between the chip transfer unit and carrier substrate to flip device orientation, then proper orientation for bonding can be achieved, but the machine cycle frequency is reduced due to additional flipping time
Solution Approach 1:
The patent extracts the orientation control function from the traditional chip flip unit and integrates it into the transfer assembly itself. The transfer assembly is configured to pick up devices in one orientation from the wafer and transfer them directly to the carrier in the required bonding orientation, eliminating the need for a separate flipping operation and reducing cycle time while maintaining proper device orientation for bonding.
Solution Approach 2:
The patent combines the transfer and orientation control functions into a single integrated transfer assembly. By merging these functions, the system achieves both device transfer and orientation adjustment in one operation, eliminating the sequential steps of transfer followed by flipping, thereby increasing machine cycle frequency while ensuring correct device orientation for subsequent bonding operations.
Data Source
AI summary
Embodiments of methods and system for transferring semiconductor devices from a wafer to a carrier structure are described. In one embodiment, a method for transferring semiconductor devices from a wafer to a carrier structure involves positioning a carrier structure with a bond surface extending in a first plane and transferring a semiconductor device from a wafer onto the bond surface of the carrier structure using a plurality of rotatable transfer assemblies. Centers of the rotatable transfer assemblies are positioned in parallel with the first plane.